Superconducting Circuits: Design and Packaging

Presentations

• Implementations of Superconducting Circuits for Quantum Computing

  Invited

  March 8, 2018, 8:00 AM – March 8, 2018, 8:36 AM

  Presenters

  • David Pappas

    • NIST
    • National Institute of Standards and Technology
    • NIST - Boulder

  Authors

  • David Pappas

    • NIST
    • National Institute of Standards and Technology
    • NIST - Boulder

  • Hsiang-Sheng Ku

    • NIST

  • Junling Long

    • National Institute of Standards and Technology
    • NIST - Boulder
    • NIST

  • Mustafa Bal

    • National Institute of Standards and Technology
    • NIST

  • Xian Wu

    • National Institute of Standards and Technology
    • NIST

  • Russell Lake

    • National Institute of Standards and Technology
    • NIST - Boulder
    • NIST
    • QCD Labs, Department of Applied Physics, Aalto University

  • Nicholas Bronn

    • IBM T. J. Watson Research Center
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr

  • Vivekananda Adiga

    • IBM TJ Watson Research Center
    • IBM

  • Salvatore Olivadese

    • IBM TJ Watson
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr

  • Baleegh Abdo

    • IBM T J Watson Res Ctr
    • IBM

  • Jerry Chow

    • IBM T.J. Watson Research Center
    • IBM T. J. Watson Research Center
    • IBM TJ Watson
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr
    • IBM T J Watson Research Center

  • Robert Erickson

    • NIST

  View abstract →

• Flip Chip Packaging for Superconducting Quantum Computers

  ORAL

  March 8, 2018, 8:36 AM – March 8, 2018, 8:48 AM

  Presenters

  • Adel Elsherbini

    • Components Research, Intel Corporation

  Authors

  • Adel Elsherbini

    • Components Research, Intel Corporation

  • Javier Falcon

    • Intel Corporation
    • Assembly Technology Test and Development, Intel Corporation

  • Jeanette Roberts

    • Components Research, Intel Corporation
    • Intel Corporation

  • Roman Caudillo

    • Components Research, Intel Corporation
    • Intel Corporation

  • Stefano Poletto

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • Kavli Institute of Nanoscience Delft, Delft University of Technology

  • Ye Seul Nam

    • Assembly Technology Test and Development, Intel Corporation

  • David Michalak

    • Components Research, Intel Corporation
    • Intel Corporation

  • Lester Lampert

    • Intel Corporation
    • Components Research, Intel Corporation

  • Zachary Yoscovits

    • Intel Corporation
    • Components Research, Intel Corporation

  • Joe Saucedo

    • Assembly Technology Test and Development, Intel Corporation

  • Alessandro Bruno

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • Kavli Institute of Nanoscience Delft, Delft University of Technology
    • QuTech, Delft Univ. of Technology

  • James Clarke

    • Components Research, Intel Corporation
    • Intel Corporation

  • Leonardo DiCarlo

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • TUD Faculty of Sciences, QuTech
    • Kavli Institute of Nanoscience Delft, Delft University of Technology

  View abstract →

• Die Design and Fabrication for Flip-Chip-Packaged Superconducting Quantum Processors

  ORAL

  March 8, 2018, 8:48 AM – March 8, 2018, 9:00 AM

  Presenters

  • Roman Caudillo

    • Components Research, Intel Corporation
    • Intel Corporation

  Authors

  • Roman Caudillo

    • Components Research, Intel Corporation
    • Intel Corporation

  • Zachary Yoscovits

    • Intel Corporation
    • Components Research, Intel Corporation

  • Lester Lampert

    • Intel Corporation
    • Components Research, Intel Corporation

  • David Michalak

    • Components Research, Intel Corporation
    • Intel Corporation

  • Adel Elsherbini

    • Intel Corporation

  • Javier Falcon

    • Intel Corporation
    • Assembly Technology Test and Development, Intel Corporation

  • Jeanette Roberts

    • Components Research, Intel Corporation
    • Intel Corporation

  • Leonardo DiCarlo

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • TUD Faculty of Sciences, QuTech
    • Kavli Institute of Nanoscience Delft, Delft University of Technology

  • James Clarke

    • Components Research, Intel Corporation
    • Intel Corporation

  View abstract →

• Towards large-scale superconducting quantum annealers: 2.5D packaging technology and application specific architecture

  ORAL

  March 8, 2018, 9:00 AM – March 8, 2018, 9:12 AM

  Presenters

  • Shiro Kawabata

    • National Institute of Advanced Industrial Science and Technology (AIST)

  Authors

  • Shiro Kawabata

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kazuhiko Endo

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Go Fujii

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Mutsuo Hidaka

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masakazu Hioki

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kentaro Imafuku

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kunihiro Inomata

    • National Institute of Advanced Industrial Science and Technology (AIST)
    • AIST

  • Vasilios Karanikolas

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Toshihiro Katashita

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Katsuya Kikuchi

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hanpei Koike

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Satoshi Kohjiro

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masaaki Maezawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Shuichi Nagasawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hiroshi Nakagawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Tadashi Nakagawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Toshihiro Sekigawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masahiro Ukibe

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Chiharu Watanabe

    • National Institute of Advanced Industrial Science and Technology (AIST)
    • AIST

  • Takahiro Yamada

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hirotake Yamamori

    • National Institute of Advanced Industrial Science and Technology (AIST)

  View abstract →

• Scalable device structure for large-scale superconducting quantum annealing machines

  ORAL

  March 8, 2018, 9:12 AM – March 8, 2018, 9:24 AM

  Presenters

  • Mutsuo Hidaka

    • National Institute of Advanced Industrial Science and Technology (AIST)

  Authors

  • Mutsuo Hidaka

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masaaki Maezawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Shuichi Nagasawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Takahiro Yamada

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kunihiro Inomata

    • National Institute of Advanced Industrial Science and Technology (AIST)
    • AIST

  • Go Fujii

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hirotake Yamamori

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masahiro Ukibe

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Shiro Kawabata

    • National Institute of Advanced Industrial Science and Technology (AIST)

  View abstract →

• Superconducting solder bumping technology for scalable quantum annealing machines

  ORAL

  March 8, 2018, 9:24 AM – March 8, 2018, 9:36 AM

  Presenters

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology (AIST)

  Authors

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masaaki Maezawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Mutsuo Hidaka

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hiroshi Nakagawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Katsuya Kikuchi

    • National Institute of Advanced Industrial Science and Technology (AIST)

  View abstract →

• Fabrication of Sn-filled superconducting through-silicon vias (SC-TSV) for large-scale superconducting quantum circuits

  ORAL

  March 8, 2018, 9:36 AM – March 8, 2018, 9:48 AM

  Presenters

  • Go Fujii

    • National Institute of Advanced Industrial Science and Technology (AIST)

  Authors

  • Go Fujii

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Masahiro Ukibe

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Mutsuo Hidaka

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Shuichi Nagasawa

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Hirotake Yamamori

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Kunihiro Inomata

    • National Institute of Advanced Industrial Science and Technology (AIST)
    • AIST

  • Takahiro Yamada

    • National Institute of Advanced Industrial Science and Technology (AIST)

  • Shiro Kawabata

    • National Institute of Advanced Industrial Science and Technology (AIST)

  View abstract →

• Enabling technologies for increased circuit complexity of high-coherence superconducting qubits: Part 1

  ORAL

  March 8, 2018, 9:48 AM – March 8, 2018, 10:00 AM

  Presenters

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  Authors

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Peter Baldo

    • MIT Lincoln Laboratory

  • Gregory Calusine

    • MIT Lincoln Laboratory

  • Alexandra Day

    • MIT Lincoln Laboratory

  • George Fitch

    • MIT Lincoln Laboratory

  • Michael Hellstrom

    • MIT Lincoln Laboratory

  • Eric Holihan

    • MIT Lincoln Laboratory

  • David Hover

    • MIT Lincoln Laboratory

  • Bethany Niedzielski

    • MIT Lincoln Laboratory

  • Brenda Osadchy

    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Gabriel Samach

    • MIT Lincoln Laboratory

  • Steven Weber

    • MIT Lincoln Laboratory

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

  View abstract →

• Enabling technologies for increased circuit complexity of high-coherence superconducting qubits: Part 2

  ORAL

  March 8, 2018, 10:00 AM – March 8, 2018, 10:12 AM

  Presenters

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  Authors

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • Massachusetts Institute of Technology
    • MIT Lincoln Laboratory

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Peter Baldo

    • MIT Lincoln Laboratory

  • Gregory Calusine

    • MIT Lincoln Laboratory

  • Michael Hellstrom

    • MIT Lincoln Laboratory

  • Bethany Niedzielski

    • MIT Lincoln Laboratory

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Brenda Osadchy

    • MIT Lincoln Laboratory

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Livia Racz

    • MIT Lincoln Laboratory

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

  View abstract →

• Extending Plane Breaking Pogo Packaging to a Lattice of 17 Superconducting Qubits

  ORAL

  March 8, 2018, 10:12 AM – March 8, 2018, 10:24 AM

  Presenters

  • Nicholas Bronn

    • IBM T. J. Watson Research Center
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr

  Authors

  • Nicholas Bronn

    • IBM T. J. Watson Research Center
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr

  • Vivekananda Adiga

    • IBM TJ Watson Research Center
    • IBM

  • Salvatore Olivadese

    • IBM TJ Watson
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr

  • Oblesh Jinka

    • IBM TJ Watson Research Center
    • IBM T J Watson Res Ctr

  • Xian Wu

    • NIST - Boulder
    • National Institute of Standards and Technology

  • Jerry Chow

    • IBM T.J. Watson Research Center
    • IBM T. J. Watson Research Center
    • IBM TJ Watson
    • IBM TJ Watson Research Center
    • IBM
    • IBM T J Watson Res Ctr
    • IBM T J Watson Research Center

  • David Pappas

    • NIST
    • National Institute of Standards and Technology
    • NIST - Boulder

  View abstract →

• 3D Integration for Superconducting Qubits: Part 1

  ORAL

  March 8, 2018, 10:24 AM – March 8, 2018, 10:36 AM

  Presenters

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  Authors

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Gregory Calusine

    • MIT Lincoln Laboratory

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Alexandra Day

    • MIT Lincoln Laboratory

  • Evan Golden

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Amy Greene

    • Massachusetts Inst of Tech-MIT
    • Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT

  • Simon Gustavsson

    • Massachusetts Institute of Technology
    • Research Laborotary of Electronics, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Research Laboratory of Electronics, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT
    • MIT
    • Research Laboratory of Electronics, Massachusetts institute of Technology

  • Philip Krantz

    • Microtechnology and nanoscience, Chalmers University of Technology
    • Research Laborotary of Electronics, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT
    • Research Laboratory of Electronics, Massachusetts Institute of Technology

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Morten Kjaergaard

    • Massachusetts Inst of Tech-MIT
    • MIT

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Bethany Niedzielski

    • MIT Lincoln Laboratory

  • Mollie Schwartz

    • MIT Lincoln Laboratory
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Steven Weber

    • MIT Lincoln Laboratory

  • Wayne Woods

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • Massachusetts Institute of Technology
    • MIT Lincoln Laboratory

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Andrew Kerman

    • MIT Lincoln Laboratory
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Lab

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

  View abstract →

• 3D Integration for Superconducting Qubits; Part 2 Superconducting Through Silicon Via Interposer Fabrication

  ORAL

  March 8, 2018, 10:36 AM – March 8, 2018, 10:48 AM

  Presenters

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  Authors

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Philip Krantz

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT

  • Matthew Cook

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Alexandra Day

    • MIT Lincoln Laboratory
    • Massachusetts Inst of Tech-MIT

  • Evan Golden

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Corey Stull

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Wayne Woods

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Andrew Kerman

    • MIT Lincoln Laboratory
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Lab

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

  View abstract →

• Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing

  ORAL

  March 8, 2018, 10:48 AM – March 8, 2018, 11:00 AM

  Presenters

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  Authors

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Philip Krantz

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT

  • Matthew Cook

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Evan Golden

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Corey Stull

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Wayne Woods

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

  View abstract →