As the field of superconducting quantum computing advances from the few-qubit scale, it will become increasingly important to develop techniques for addressing large number of qubits without degrading their performance. 3D integration can alleviate interconnect crowding and enable the construction of large-scale arrays of coupled coherent superconducting qubits. I will present our recent work on developing and characterizing 3D integration components for quantum annealing, including indium bumps and superconducting through-silicon vias, and discuss progress towards building 3D integrated coupled qubits.
*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) via MIT Lincoln Laboratory under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be
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Presenters
Danna Rosenberg
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Lincoln Laboratory, Massachusetts Inst of Tech-MIT
Authors
Danna Rosenberg
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Lincoln Laboratory, Massachusetts Inst of Tech-MIT
Gregory Calusine
MIT Lincoln Laboratory
Rabindra Das
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Alexandra Day
MIT Lincoln Laboratory
Evan Golden
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Amy Greene
Massachusetts Inst of Tech-MIT
Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT
Simon Gustavsson
Massachusetts Institute of Technology
Research Laborotary of Electronics, Massachusetts Institute of Technology
Massachusetts Inst of Tech-MIT
Research Laboratory of Electronics, Massachusetts Institute of Technology
Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT
MIT
Research Laboratory of Electronics, Massachusetts institute of Technology
Philip Krantz
Microtechnology and nanoscience, Chalmers University of Technology
Research Laborotary of Electronics, Massachusetts Institute of Technology
Massachusetts Inst of Tech-MIT
Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT
Research Laboratory of Electronics, Massachusetts Institute of Technology
David Kim
MIT Lincoln Laboratory
MIT Lincoln Lab
Lincoln Laboratory, Massachusetts Institute of Technology
Massachusetts Inst of Tech-MIT
Lincoln Laboratory, Massachusetts Inst of Tech-MIT
Morten Kjaergaard
Massachusetts Inst of Tech-MIT
MIT
Justin Mallek
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
MIT Lincoln Laboratory
Alexander Melville
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Bethany Niedzielski
MIT Lincoln Laboratory
Mollie Schwartz
MIT Lincoln Laboratory
Lincoln Laboratory, Massachusetts Inst of Tech-MIT
Steven Weber
MIT Lincoln Laboratory
Wayne Woods
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
Jonilyn Yoder
Massachusetts Institute of Technology
MIT Lincoln Laboratory
Donna-Ruth Yost
MIT Lincoln Lab
Massachusetts Inst of Tech-MIT
MIT Lincoln Laboratory
Andrew Kerman
MIT Lincoln Laboratory
Massachusetts Inst of Tech-MIT
MIT Lincoln Lab
William Oliver
MIT Lincoln Laboratory
MIT Lincoln Lab
Massachusetts Institute of Technology & MIT Lincoln Laboratory
Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
Massachusetts Inst of Tech-MIT
Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
MIT
Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology