Enabling technologies for increased circuit complexity of high-coherence superconducting qubits: Part 2

ORAL

Abstract

As quantum computing with superconducting qubits increases in complexity, 3D integration will enable increased density of control and readout circuitry. One approach is to bond chips that perform different functionalities using indium bumps. MIT Lincoln Laboratory has integrated silicon hard-stop mesas to achieve reliable spacing and tilt between chips during bump bonding. Here we will describe further development of hard-stop mesas, assessment of tilt and integration into high-coherence superconducting qubit fabrication.

*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily

–

Presenters

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

Authors

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • Massachusetts Institute of Technology
    • MIT Lincoln Laboratory

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Peter Baldo

    • MIT Lincoln Laboratory

  • Gregory Calusine

    • MIT Lincoln Laboratory

  • Michael Hellstrom

    • MIT Lincoln Laboratory

  • Bethany Niedzielski

    • MIT Lincoln Laboratory

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Brenda Osadchy

    • MIT Lincoln Laboratory

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Livia Racz

    • MIT Lincoln Laboratory

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology