3D Integration for Superconducting Qubits; Part 2 Superconducting Through Silicon Via Interposer Fabrication

ORAL

Abstract

Quantum annealing requires addressing and connecting an array of qubits. Integration requirements are driven by performance requirements, including high connectivity, low dissipation, and high qubit coherence. In this talk we describe our process flow for fabricating wafers with superconducting through silicon vias (TSVs) leveraging commercial 3D integration tools and techniques. This work demonstrates a means to control and readout an array of superconducting qubits.

*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein a

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Presenters

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

Authors

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Philip Krantz

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT

  • Matthew Cook

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Alexandra Day

    • MIT Lincoln Laboratory
    • Massachusetts Inst of Tech-MIT

  • Evan Golden

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Corey Stull

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Wayne Woods

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Andrew Kerman

    • MIT Lincoln Laboratory
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Lab

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology