Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing

ORAL

Abstract

Three dimensional integration is an enabling technology for quantum computing. As we progress toward many-qubit systems which require rapidly increasing circuit connectivity one approach is to route qubit control and readout through an interposer layer containing superconducting TSVs. We report on the fabrication of high aspect ratio (>10:1) superconducting TSVs and discuss electrical and reliability data on single vias and long via chains.

*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) under Air Force Contract No. FA8721-05-C-0002.

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Presenters

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

Authors

  • Justin Mallek

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Donna-Ruth Yost

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Philip Krantz

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT
    • MIT

  • Matthew Cook

    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Rabindra Das

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Evan Golden

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • David Kim

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Corey Stull

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Wayne Woods

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • William Oliver

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Massachusetts Institute of Technology & MIT Lincoln Laboratory
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Inst of Tech-MIT
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT
    • MIT
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology
    • Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology