Through the dispersion relation of electromagnetic waves propagating into un-magnetized plasma or ordinary wave in magnetized plasma: ω2 = ωpe2 + c2k2 where ω2, ωpe2, c, and k are the wave frequency, the plasma frequency, the speed of light, and the wave number, the wave cutoff frequency becomes the plasma frequency as ωcutoff = ωpe = (nee2/ε0m)0.5 when k = zero. Thus, we can obtain the absolute electron density from the measurement of the ωcutoff. This method is called the wave-cutoff probe [1]. In this talk, we present research overview and achievements on the wave-cutoff probe, as follows. First, theory and apparatus of the wave-cutoff probe method are introduced. Second, various technical methods, such as conventional wave-cutoff, phase resolved wave-cutoff, and Fourier wave-cutoff are presented [2]. Third, a method measuring electron temperature, as well as the electron density is shown [3]. Forth, flat cutoff probe for industrial plasma processing monitoring was developed [4]. Fifth, interesting and pioneering works were done with bar-type flat cutoff probe [5], such as electron density measurement at the sheath-plasma boundary and real-time electron density measurement even though the wafer. Finally, we will show the ion density measurement using the wave-cutoff probe [6]. Thanks to this accurate plasma metrology method that can measure the absolute ion and electron densities at the same time, we demonstrate the verified quasi-neutrality of the plasmas for the first time [6].
*This research was supported by the Material Innovation Program (Grant No. 2020M3H4A3106004), the R&D Convergence Program (Grant No. CAP- 17–02-NFRI-01/CRC-20–01-NFRI) and the Korea Research Institute of Standards and Science (Grant No. KRISS GP2020–0009-03).
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Publication:[1] Appl. Phys. Lett., 83 4725 (2003). Rev. Sci. Instrum. 75 2706 (2004), Metrologia 42 110 (2005). [2] Appl. Phys. Lett., 96, 081502 (2010). Rev. Sci. Instrum. 83, 013510 (2012). [3] Appl. Phys. Lett. 91, 201502 (2007). [4] Hyo-Chang Lee, Jung Hyung Kim, Dae, Daejin Seong, Hee Jung Yeom, PLANAR-TYPE PLASMA DIAGNOSIS APPARATUS, WAFER-TYPE PLASMA DIAGNOSIS APPARATUS IN WHICH PLANAR-TYPE PLASMA DIAGNOSIS APPARATUS IS BURIED, AND ELECTROSTATIC CHUCK IN WHICH PLANAR-TYPE PLASMA DIAGNOSIS APPARATUS IS BURIED, Korea Patent. 10-2020-0095022 , PCT Patent. PCT/KR2019/004500, US Patent. 17050373, China Patent. 201980028803.9, EU Patent. 19912976.8, Japan Patent. 52002369478, Plasma Sources Sci. Technol. 28 015004 (2019), Plasma Sources Sci. Technol. 29 035016 (2020), Plasma Sources Sci. Technol. in-press (https://doi.org/10.1088/1361-6595/abef1a) [5] Plasma Sources Sci. Technol. 29 035016 (2020). [6] Hyo-Chang Lee, Jung Hyung Kim, Dae, Hee Jung Yeom, Device for measuring plasma ion density and Apparatus for plasma diagnostics using the same, Korea Patent. 1020210038119, US Patent. 17222937, China Patent. 2021110374496.9, EU Patent. EP21167098.9, Japan Patent. 2021-062613
Presenters
Hyo-Chang Lee
Korea Research Institute of Standards and Science
Korea Research Institute of Standards and Science (KRISS)
Korea Research Inst of Standards and Sci
Authors
Hyo-Chang Lee
Korea Research Institute of Standards and Science
Korea Research Institute of Standards and Science (KRISS)
Korea Research Inst of Standards and Sci
Jung Hyung Kim
Korea Research Institute of Standards and Science
Korea Research Institute of Standard and Science (KRISS)
Korea Research Institute of Standards and Science (KRISS)