Material Processing II

Presentations

• Evaluation of Plasma Ashing Damages on Porous SiOCH Films by Measurement of H and N Radical Densities

  ORAL

  Oct. 17, 2008, 12:30 PM – Oct. 17, 2008, 12:45 PM

  Authors

  • Hiroshi Yamamoto

    • Nagoya University

  • Keigo Takeda

    • Nagoya University

  • Makoto Sekine

    • Nagoya University

  • Masaru Hori

    • Nagoya University

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• Threshold energy for plasma etching of high-$k$ dielectric HfO$_{2}$ films in BCl$_{3}$-containing plasmas

  ORAL

  Oct. 17, 2008, 12:45 PM – Oct. 17, 2008, 1:00 PM

  Authors

  • Yoshinori Ueda

    • Kyoto University

  • Keisuke Nakamura

    • Kyoto University

  • Hiroaki Kiyokami

    • Kyoto University

  • Hiroaki Ohta

    • Kyoto University

  • Koji Eriguchi

    • Kyoto University

  • Kouichi Ono

    • Kyoto University

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• Etch Challenges Brought by the Metal Hardmask Approach for Advanced Contact Patterning with Fluorocarbon-based Plasma

  ORAL

  Oct. 17, 2008, 1:00 PM – Oct. 17, 2008, 1:15 PM

  Authors

  • Jean-Francois de Marneffe

    • IMEC v.z.w. 75 Kapeldreef B-3001 Leuven, Belgium

  • Danny Goossens

    • IMEC v.z.w. 75 Kapeldreef B-3001 Leuven, Belgium

  • Denis Shamiryan

    • IMEC v.z.w. 75 Kapeldreef B-3001 Leuven, Belgium

  • Herbert Struyf

    • IMEC v.z.w. 75 Kapeldreef B-3001 Leuven, Belgium

  • Werner Boullart

    • IMEC v.z.w. 75 Kapeldreef B-3001 Leuven, Belgium

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• Porous Low-k Material Etch For 32 nm and Beyond

  ORAL

  Oct. 17, 2008, 1:15 PM – Oct. 17, 2008, 1:30 PM

  Authors

  • Yifeng Zhou

    • Applied Materials, Inc.

  • Qingjun Zhou

    • Applied Materials, Inc.

  • Ryan Patz

    • Applied Materials, Inc.

  • Hairong Tang

    • Applied Materials, Inc.

  • Jeremiah Pender

    • Applied Materials, Inc.

  • Michael Armacost

    • Applied Materials, Inc.

  • Catherine Labelle

    • Advanced Micro Devices

  • David Horak

    • IBM Research

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• ABSTRACT WITHDRAWN

  Oct. 17, 2008, 1:30 PM – Oct. 17, 2008, 1:45 PM

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• Control Capabilities of Low-Inductance-Antenna-Driven RF Plasmas for Low-Damage Processing of Polymers

  ORAL

  Oct. 17, 2008, 1:45 PM – Oct. 17, 2008, 2:00 PM

  Authors

  • Yuichi Setsuhara

    • Osaka Univ., JST, CREST

  • Kosuke Takenaka

    • Osaka Univ.

  • Ken Cho

    • Osaka Univ.

  • Akinori Ebe

    • EMD Corp.

  • Masaharu Shiratani

    • Kyushu Univ., JST, CREST
    • Kyushu University, JST, CREST
    • Kyushu University

  • Makoto Sekine

    • Nagoya Univ., JST, CREST

  • Masaru Hori

    • Nagoya Univ., JST, CREST
    • Nagoya University, Japan

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• Impact of Wafer Bias in an Inductively Coupled Plasma Reactor

  ORAL

  Oct. 17, 2008, 2:00 PM – Oct. 17, 2008, 2:15 PM

  Authors

  • P. Kothnur

    • Novellus Systems, Inc.
    • Novellus Systems, Inc

  • Ananth Bhoj

    • Novellus Systems, Inc.

  • Xiaohui Yuan

    • Esgee Technologies Inc.

  • Laxminarayan Raja

    • The University of Texas at Austin
    • Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, TX 78735

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• The effect of plasmas on the equilibrium shapes of semi-conducting nanocrystals

  ORAL

  Oct. 17, 2008, 2:15 PM – Oct. 17, 2008, 2:30 PM

  Authors

  • Eugene Tam

    • The University of Sydney

  • Kostya Ostrikov

    • CSIRO
    • The University of Sydney

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