Comparison of epoxy-based encapsulating materials over temperature and strain-rate

POSTER

Abstract

The effects of varying strain rates and temperatures on the compressive response of an epoxy resin with and without alumina filler have been investigated. The samples are studied in the range of temperatures from $-20\,^{\circ}\mathrm{C}$ to $+80\,^{\circ}\mathrm{C}$ over a range of strain rates (10$^{-4}$ s$^{-1}$ to 10$^{+3}$ s$^{-1}$). Three loading devices were used to access this range: an Instron, drop weight and a Split Hopkinson Pressure Bar. Stress-strain data was obtained, along with high-speed images. The response of the materials is compared and discussed in relation to their use as encapsulants of piezoelectric systems.

*The Institute of Shock Physics acknowledges the support of AWE, Aldermaston, UK and Imperial College London.

Authors

  • Amnah Khan

    • Institute of Shock Physics, Blackett Laboratory, Imperial College London, London, UK, SW7 2BW

  • William Proud

    • Imperial College London
    • Institute of Shock Physics, Imperial College London
    • Institute of Shock Physics, Blackett Laboratory, Imperial College London, London, UK, SW7 2BW
    • Institute of Shock Physics \& Centre for Blast Injury Studies, Imperial College London