Strain engineering of KTaO<sub>3</sub> grown by Suboxide Molecular-Beam Epitaxy

ORAL

Abstract

Strain-engineering is a powerful means to tune the polar, structural, and electronic instabilities of ferroelectrics. KTaO3 is an incipient ferroelectric, with a very large spin-orbit coupling, in which highly anisotropic superconductivity emerges near a polar instability in electron doped samples[1, 2]. Growth of high-quality epitaxial films provides an opportunity to use epitaxial strain to finely tune electronic and polar instabilities in KTaO3. Using a molecular beam of the suboxides TaO2 emanating from effusion cells containing Ta2O5 combination with a molecular beam of potassium emanating from an indium-potassium intermetallic in an oxidant (~10% O3 + 90% O2) background pressure of 1x10–6 Torr, KTaO3 films are grown under conditions of excess potassium in an absorption-controlled regime. Biaxial strains ranging from to are imposed on the commensurately strained KTaO3 films by growing them upon GdScO3, TbScO3, DyScO3 and SrTiO3 substrates, all with the perovskite structure. To probe dielectric and ferroelectric properties, KTaO3 films were grown on conductive substrates i.e., Nb-doped SrTiO3 as well as metal-insulator-metal capacitors made with symmetric perovskite electrodes. Reciprocal-space mapping shows the epitaxial thin films are coherently strained to the underlying perovskite substrates provided the films are sufficiently thin. Cross-sectional scanning transmission electron microscopy does not show any extended defects and confirms that the films have an atomically abrupt interface with the substrate. X-ray diffraction rocking curves (full width at half maximum < 30 arc sec on all the above substrates) are the narrowest reported to date for KTaO3 films grown by any technique. Temperature- and polarization-dependent second harmonic generation measurements show evidence of strain-dependent broken inversion symmetry leading to polar order in KTaO3 thin films. SIMS measurements confirm that the films are free of indium contamination.

References

[1] K. Ueno, S. Nakamura, H. Shimotani, H. T. Yuan, N. Kimura, T. Nojima, H. Aoki, Y. Iwasa, and M. Kawasaki, Nat. Nanotechnol. 6, 408 (2011).

[2] F. Y. Bruno, S. M. Walker, S. Riccò, A. d. l. Torre, Z. Wang, A. Tamai, T. K. Kim, M. Hoesch, M. S. Bahramy, and F. Baumberger. Adv. Electron. Mater. 5, 1800860 (2019).

Presenters

  • Tobias Schwaigert

    • Cornell University

Authors

  • Tobias Schwaigert

    • Cornell University
  • Sankalpa Hazra

    • Pennsylvania State University
  • salva Salmani-Rezaie

    • Ohio state university
    • The Ohio State University
  • tatiana Kuznetsova

    • Pennsylvania State University
    • The Pennsylvania State University
  • Steffen Ganschow

    • Leibniz Institut für Kristallzüchtung
  • Michael D Williams

    • Clark Atlanta Univ
  • David A Muller

    • Cornell University
  • Roman Engel-Herbert

    • Paul Druide Institute for Solid state electronics (PDI)
    • Paul Drude Institute for Solid State Electronics
  • Hanjong Paik

    • University of Oklahoma
  • Venkatraman Gopalan

    • Pennsylvania State University
    • The Pennsylvania State University
  • Darrell G Schlom

    • Cornell University
    • Department of Materials Science and Engineering, Cornell University
  • Kaveh Ahadi

    • Ohio State University
    • The Ohio State University