A 3-tier stack for 3D integration of superconducting quantum systems – part 2: qubit design and performance

ORAL

Abstract

A key goal of any extensible architecture for quantum information processing is to enhance connectivity and functionality while preserving qubit coherence. We describe the design and operation of high-coherence superconducting qubits in a 3D-integrated 3-tier stack that utilizes an interposer with superconducting through-silicon vias (TSVs) to connect qubits to multi-level superconducting routing while preserving qubit performance by isolating qubits from lossy dielectrics in the routing tier. Fabrication processes that produce high-coherence qubits are used on both the qubit and interposer tiers. Readout and control circuitry, including resonators and qubit control lines, are located on the interposer tier. All components are accessed using TSVs in the interposer tier and bump bonds between the tiers.

*This work is supported by a collaboration between the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator; the Defense Advanced Research Projects Agency; and the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Department of Energy, the Under Secretary of Defense for Research and Engineering, or the Defense Advanced Research Projects Agency.

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Publication: D. Yost et al., Solid-state qubits integrated with superconducting through-silicon vias, npj Quantum Information 6, 59 (2020)

D. Rosenberg et al., Solid-state qubits: 3D integration and packaging, IEEE Microwave Magazine 21, 72 (2020).

C.F. Hirjibehedin, D.-R.W. Yost et al., in preparation

Presenters

  • Cyrus F Hirjibehedin

    • MIT Lincoln Lab

Authors

  • Cyrus F Hirjibehedin

    • MIT Lincoln Lab

  • Donna-Ruth W Yost

    • Massachusetts Institute of Technology MIT
    • MIT - Lincoln Laboratory

  • Justin L Mallek

    • MIT Lincoln Lab

  • Danna Rosenberg

    • Massachusetts Institute of Technology MIT

  • Rabindra Das

    • Massachusetts Institute of Technology MIT
    • MIT Lincoln Lab

  • Kate Azar

    • MIT Lincoln Laboratory

  • Katrina Sliwa

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab

  • Thomas M Hazard

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Vladimir Bolkhovsky

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Evan Golden

    • MIT LIncoln Lab
    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • David K Kim

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Jeffrey Knecht

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory

  • Bethany M Niedzielski

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Meghan Schuldt

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab

  • Ravi Rastogi

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Kyle Serniak

    • MIT Lincoln Laboratory

  • Steven J Weber

    • MIT Lincoln Lab

  • Wayne Woods

    • MIT Lincoln Lab

  • Scott Zarr

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Andrew J Kerman

    • MIT Lincoln Lab

  • William D Oliver

    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology (MIT), MIT Lincoln Laboratory
    • Massachusetts Institute of Technology (MIT)
    • Massachusetts Institute of Technology
    • Massachusetts Institute of Technology, MIT Lincoln Laboratory

  • Mollie E Schwartz

    • MIT Lincoln Laboratory

  • Jonilyn L Yoder

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory