A 3-tier stack for 3D integration of superconducting quantum systems – part 1: Interposer tier with superconducting TSVs and qubits

ORAL

Abstract

Complex systems of superconducting qubits present engineering challenges for robust control and readout of multi-qubit systems. We have developed a 3D integration approach that utilizes a 3-tier stack to provide access to multi-level superconducting circuitry. The 3D integrated stack is composed of a top qubit tier, a bottom superconducting multichip module (SMCM) tier, and an intermediate interposer tier. The interposer separates the qubits from the SMCM tier, reducing the impact of lossy dielectrics in the multilevel wiring of the SMCM on the coherence of the qubits. An active interposer tier with superconducting TSVs provides both connectivity and enhanced functionality with additional layers for resonators, qubits, and novel qubit devices which utilize the TSVs. We will discuss fabrication and characterization of our 3-tier stack platform for control and readout of multi-qubit systems.

*This work is supported by a collaboration between the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator; the Defense Advanced Research Projects Agency; and the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Department of Energy, the Under Secretary of Defense for Research and Engineering, or the Defense Advanced Research Projects Agency.

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Publication: D. Yost et al., Solid-state qubits integrated with superconducting through-silicon vias, npj Quantum Information 6, 59 (2020)
D. Rosenberg et al., Solid-state qubits: 3D integration and packaging, IEEE Microwave Magazine 21 (8), 72 (2020).
C.F. Hirjibehedin, and D. Yost, et al., in preparation

Presenters

  • Donna-Ruth W Yost

    • Massachusetts Institute of Technology MIT
    • MIT - Lincoln Laboratory

Authors

  • Donna-Ruth W Yost

    • Massachusetts Institute of Technology MIT
    • MIT - Lincoln Laboratory

  • Cyrus F Hirjibehedin

    • MIT Lincoln Lab

  • Justin L Mallek

    • MIT Lincoln Lab

  • Danna Rosenberg

    • Massachusetts Institute of Technology MIT

  • Rabindra Das

    • Massachusetts Institute of Technology MIT
    • MIT Lincoln Lab

  • Kate Azar

    • MIT Lincoln Laboratory

  • Katrina Silwa

    • MIT Lincoln Laboratory

  • Thomas M Hazard

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Vladimir Bolkhovsky

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Evan Golden

    • MIT LIncoln Lab
    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • David K Kim

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Jeffrey Knecht

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory

  • Bethany M Niedzielski

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Meghan Schuldt

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab

  • Ravi Rastogi

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Kyle Serniak

    • MIT Lincoln Laboratory

  • Steven J Weber

    • MIT Lincoln Lab

  • Wayne Woods

    • MIT Lincoln Lab

  • Scott Zarr

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Andrew J Kerman

    • MIT Lincoln Lab

  • William D Oliver

    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology (MIT), MIT Lincoln Laboratory
    • Massachusetts Institute of Technology (MIT)
    • Massachusetts Institute of Technology
    • Massachusetts Institute of Technology, MIT Lincoln Laboratory

  • Mollie E Schwartz

    • MIT Lincoln Laboratory

  • Jonilyn L Yoder

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory