Design and Characterization of 3D-Integrated Superconducting Qubit Lattices

ORAL

Abstract

Superconducting qubits hold the promise of individual qubit control and readout, with broad tunability of qubit frequencies and coupling strengths. However, in-plane interconnect routing becomes prohibitive for even moderately sized lattices due to space constraints. Here, we incorporate flip-chip 3D integration technology in the design of mesoscale qubit lattices. This allows us to reduce interconnect density and enables the control and readout of all qubits in larger-scale processors. We report on the improvements to loss and crosstalk enabled by 3D integration.

*This work was supported by a NASA Space Technology Research Fellowship. This research was funded in part by the US Department of Energy, Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division under contract no. DE-AC02-05-CH11231 within the High-Coherence Multilayer Superconducting Structures for Large Scale Qubit Integration and Photonic Transduction programme (QISLBNL); and by the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001.

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Presenters

  • Sarah E Muschinske

    • Massachusetts Institute of Technology MI
    • Massachusetts Institute of Technology
    • Massachusetts Institute of Technology MIT

Authors

  • Sarah E Muschinske

    • Massachusetts Institute of Technology MI
    • Massachusetts Institute of Technology
    • Massachusetts Institute of Technology MIT

  • Patrick M Harrington

    • Massachusetts Institute of Technology MI
    • Department of Electrical Engineering & Computer Science and Department of Physics, Massachusetts Institute of Technology
    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology

  • Amir H Karamlou

    • Massachusetts Institute of Technology MI
    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology

  • Jochen Braumueller

    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology

  • Agustin Di Paolo

    • Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
    • Universite de Sherbrooke
    • MIT
    • Massachusetts Institute of Technology MIT
    • Research Laboratory of Electronics, Massachusetts Institute of Technology
    • Massachusetts Institute of Technology

  • Thomas M Hazard

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • David K Kim

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Alexander Melville

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab

  • Bethany M Niedzielski

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Danna Rosenberg

    • Massachusetts Institute of Technology MIT

  • Jonilyn L Yoder

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Mollie E Schwartz

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Jeffrey A Grover

    • Massachusetts Institute of Technology MI
    • Massachusetts Institute of Technology Department of Electrical Engineering and Computer Science
    • Massachusetts Institute of Technology MIT
    • Northrop Grumman - Mission Systems
    • Massachusetts Institute of Technology

  • Simon Gustavsson

    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology

  • William D Oliver

    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology Research Laboratory of Electronics
    • MIT Lincoln Laboratory and Department of Electrical Engineering & Computer Science and Department of Physics, Massachusetts Institute of Technology