Scalable Quantum i/o: Advances in Integrated Cryogenic Microwave Components in Flexible Stripline Structures Part 2/2

ORAL

Abstract

Conventional cryogenic coaxial cabling and filtering solutions for quantum computing have limited scaling potential towards and beyond the kQbit regime due to cost, connection-density, form-factor and heat-load. In this work, we present advances in monolithic flexible RF cabling, which directly connects room temperature electronics to the cryogenic interface of a quantum device.

In particular we focus on fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators with performances on-par with high-end coaxial solutions. We experimentally verify that the flat cabling is well-thermalized at cryogenic temperatures as low as 50mK. Finally we present the results of full two-port calibrated cryogenic microwave measurements performed on flexible superconducting RF hardware. In this second part of a two-part presentation, we present results of thermalization and heatload experiments on the flexible cabling alongside characterization of superconducting flexible cabling.

 

*The development of Cri/oFlex®-3 is supported by the Horizon 2020 EIC Accelerator grant. Some of the research in this talk is part of the AVaQus project supported by the FET Open initiative from the European Union's Horizon 2020 research and innovation program.

Presenters

  • Daniël Bouman

    • Delft Circuits

Authors

  • Daniël Bouman

    • Delft Circuits
  • Kiefer Vermeulen

    • Delft Circuits
  • Ruben van Gulik

    • Delft Circuits
  • Chun Heung Wong

    • Delft Circuits
  • Wouter Bos

    • Delft Circuits
  • Nikolai Drobotun

    • Delft Circuits
  • Rob van den Brink

    • Delft Circuits
  • Jakob Kammhuber

    • Delft Circuits
  • Patrick Paluch

    • Karlsruhe Institute of Technology
  • Viktor Adam

    • Karlsruhe Institute of Technology
  • Wolfgang Wernsdorfer

    • Karlsruhe Institute of Technology
  • Ioan-Mihai Pop

    • Karlsruhe Institute of Technology
  • Vivien Thiney

    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    • Univ. Grenoble Alpes, CEA, Leti
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble
    • Univ. Grenoble Alpes, CNRS, Grenoble INP, Institut Néel, Grenoble, France
    • Institut Néel CNRS
  • Laurent Colas

    • Universite de Sherbrooke
    • Université de Sherbrooke
  • Marc-André Tétrault

    • Université de Sherbrooke
  • Michel Pioro-Ladriere

    • Universite de Sherbrooke
  • Daan Kuitenbrouwer

    • Delft Circuits
  • Sal Bosman

    • Delft Circuits