Scalable Quantum i/o: Advances in Integrated Cryogenic Microwave Components in Flexible Stripline Structures Part 1/2
ORAL
Abstract
Conventional cryogenic coaxial cabling and filtering solutions for quantum computing have limited scaling potential towards and beyond the kQbit regime due to cost, connection-density, form-factor and heat-load. In this work, we present advances in monolithic flexible RF cabling, which directly connects room temperature electronics to the cryogenic interface of a quantum device.
In particular we focus on fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators with performances on-par with high-end coaxial solutions. We experimentally verify that the flat cabling is well-thermalized at cryogenic temperatures as low as 50mK. Finally we present the results of full two-port calibrated cryogenic microwave measurements performed on flexible superconducting RF hardware. In this first part of a two-part presentation, we introduce the flexible cabling concept and present fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators. As well as benchmarking measurements on state-of-the-art quantum devices.
In particular we focus on fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators with performances on-par with high-end coaxial solutions. We experimentally verify that the flat cabling is well-thermalized at cryogenic temperatures as low as 50mK. Finally we present the results of full two-port calibrated cryogenic microwave measurements performed on flexible superconducting RF hardware. In this first part of a two-part presentation, we introduce the flexible cabling concept and present fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators. As well as benchmarking measurements on state-of-the-art quantum devices.
*The development of Cri/oFlex®-3 is supported by the Horizon 2020 EIC Accelerator grant. Some of the research in this talk is part of the AVaQus project supported by the FET Open initiative from the European Union's Horizon 2020 research and innovation program.
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Presenters
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Kiefer Vermeulen
- Delft Circuits