High-density I/O for next-generation quantum annealing: Part 2—Device packaging

ORAL

Abstract

As superconducting quantum processors continue to scale up in size, it becomes increasingly challenging to route the required number of control lines through a dilution refrigerator to the qubit chip. In this presentation, we will discuss our efforts to develop high-density packaging for use in next-generation quantum annealers. Our packaging solutions integrate with our low crosstalk flexible multi-channel cables, and are designed to maintain isolation and moderate bandwidth. We will describe the design and electrical performance of the packages.

*This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and the Defense Advanced Research Projects Agency (DARPA) under Air Force Contract No. FA8702-15-D-0001. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the ODNI, IARPA, DARPA, or the U.S. Government.

–

Presenters

  • John Cummings

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

Authors

  • John Cummings

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

  • Steven Weber

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, MIT
    • MIT - Lincoln Laboratory

  • Jovi Miloshi

    • MIT Lincoln Lab

  • Kyle J Thompson

    • MIT Lincoln Lab

  • John Rokosz

    • MIT Lincoln Lab

  • David Holtman

    • MIT Lincoln Lab

  • David Conway

    • MIT Lincoln Lab

  • Andrew James Kerman

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, MIT
    • MIT - Lincoln Laboratory

  • William Oliver

    • MIT Lincoln Laboratory
    • Research Laboratory of Electronics, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science
    • MIT Research Laboratory of Electronics, MIT Lincoln Laboratory, MIT Department of Electrical Engineering and Computer Science
    • Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology
    • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory
    • MIT
    • MIT, MIT Lincoln Lab
    • MIT Lincoln Lab
    • MIT Lincoln Lab, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, and Department of Physics, Massachusetts Institute of Technology. MIT Lincoln L
    • Department of Physics, Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technol
    • Lincoln Laboratory, Research Laboratory of Electronics, and Department of Electrical Engineering & Computer Science, MIT