High-density I/O for next-generation quantum annealing: Part 1—Cryogenic wiring

ORAL

Abstract

As superconducting quantum processors continue to scale up in size, it becomes increasingly challenging to route the required number of control lines through a dilution refrigerator to the qubit chip. In this presentation, we will discuss our efforts to develop high-density fridge wiring for use in next-generation quantum annealers. Our wiring solution is based on flexible multi-channel cables with a stripline geometry, designed to achieve low crosstalk and moderate bandwidth. We will describe the electrical performance of these cables, as well as other design considerations such as thermal management.

*This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and the Defense Advanced Research Projects Agency (DARPA) under Air Force Contract No. FA8702-15-D-0001. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the ODNI, IARPA, DARPA, or the U.S. Government.

–

Presenters

  • Steven Weber

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, MIT
    • MIT - Lincoln Laboratory

Authors

  • Steven Weber

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, MIT
    • MIT - Lincoln Laboratory

  • John Cummings

    • MIT Lincoln Lab

  • Jovi Miloshi

    • MIT Lincoln Lab

  • Kyle J Thompson

    • MIT Lincoln Lab

  • John Rokosz

    • MIT Lincoln Lab

  • David Holtman

    • MIT Lincoln Lab

  • David Conway

    • MIT Lincoln Lab

  • Andrew James Kerman

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • Lincoln Laboratory, MIT
    • MIT - Lincoln Laboratory

  • William Oliver

    • MIT
    • MIT Lincoln Lab