Scalable packaging design for large-scale superconducting quantum circuits

ORAL

Abstract

While recent progress on superconducting quantum circuits has enabled us to realize intermediate-scale quantum processers, we need to scale up the number of qubits even more to realize a fully fault-tolerant quantum computer. One of the biggest challenges when scaling up the two-dimensional array of qubits is to wire control and readout lines to every qubit in use. The wiring from the side of a chip becomes more difficult with an increased number of qubits. To overcome this difficulty, we propose scalable packaging and wiring schemes based on the vertical connection of coaxial cables from the bottom of the chip. The vertically connected cable and qubit structure enables us to treat the unit structure as a module and scale it up by tiling the same structure in two dimensions. We will present the design and performance of our chip and package. We also discuss the scalability of this scheme by focusing on the spurious mode and cross-talk.

*This work was supported by JST ERATO (Grant No. JPMJER1601) and MEXT Q-LEAP (Grant No. JPMXS0118068682).

–

Presenters

  • Shuhei Tamate

    • Research Center for Advanced Science and Technology, The University of Tokyo
    • The University of Tokyo

Authors

  • Shuhei Tamate

    • Research Center for Advanced Science and Technology, The University of Tokyo
    • The University of Tokyo

  • Yutaka Tabuchi

    • Research Center for Advanced Science and Technology, The University of Tokyo

  • Laszlo Szikszai

    • Center for Emergent Matter Science, RIKEN

  • Koichi Kusuyama

    • Center for Emergent Matter Science, RIKEN

  • Kun Zuo

    • Center for Emergent Matter Science, RIKEN
    • RIKEN

  • Zhiguang Yan

    • Center for Emergent Matter Science, RIKEN

  • Alexander Badrutdinov

    • Center for Emergent Matter Science, RIKEN

  • Yuji Hishida

    • National Institute of Information and Communications Technology

  • Wei Qiu

    • NICT
    • National Institute of Information and Communications Technology

  • Hirotaka Terai

    • National Institute of Information and Communications Technology
    • NICT

  • Go Fujii

    • National Institute of Advanced Industrial Science and Technology

  • Kazumasa Makise

    • National Institute of Advanced Industrial Science and Technology

  • Naoya Watanabe

    • National Institute of Advanced Industrial Science and Technology

  • Hiroshi Nakagawa

    • National Institute of Advanced Industrial Science and Technology

  • Masahisa Fujino

    • National Institute of Advanced Industrial Science and Technology

  • Masahiro Ukibe

    • National Institute of Advanced Industrial Science and Technology

  • Wataru Mizubayashi

    • National Institute of Advanced Industrial Science and Technology

  • Katsuya Kikuchi

    • National Institute of Advanced Industrial Science and Technology

  • Yasunobu Nakamura

    • The University of Tokyo
    • Center for Emergent Matter Science, RIKEN
    • Center for Emergent Matter Science (CEMS), RIKEN
    • RCAST, The University of Tokyo
    • Research Center for Advanced Science and Technology, The University of Tokyo
    • Research Center for Advanced Science and Technology (RCAST), The University of Tokyo
    • RIKEN