Design and Characterization of Microwave Packages for Superconducting Qubits
ORAL
Abstract
Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront towards the realization of practical quantum processors. However, the high-fidelity and simultaneous control over these qubits remains a challenge in achieving quantum computation at scale. Multiple, often interrelated factors such as spurious modes, conduction losses, and crosstalk impose challenges that require a comprehensive approach to package design. Here, we provide an overview of our recent work aimed at systematically addressing these challenges, including mode suppression, chip-to-board interconnect design, interposer design, and material choices. We present results from simulations and demonstrate the corresponding physical characterization of the electromagnetic environment of the qubit.
*This research was funded in part by the U.S. Army Research Office (ARO) Multidisciplinary University Research Initiative (MURI) W911NF-18-1-0411, and by the Department of Defense via Lincoln Laboratory under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements of the US Government.
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Presenters
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Sihao Huang
- Department of Physics, Massachusetts Institute of Technology