Principles of Microwave Package Design for Superconducting Quantum Processors
ORAL
Abstract
Superconducting qubits are amongst the most promising platforms towards building near term, practical quantum information processors. As the number of qubits per device increases, package design becomes an increasingly important aspect enabling efficient qubit control. Multiple, often interrelated factors such as spurious modes, conduction losses, and crosstalk impose challenges that require a comprehensive approach to package design. Here, we provide an overview of our recent work aimed at addressing these challenges, including chip-to-board interconnect design, interposer design, and material choices. We present results from simulations of these elements and corresponding physical measurements on a newly designed package.
*This research was funded in part by the ARO grant No. W911NF-18-1-0411; and by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.
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Presenters
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Sihao Huang
- Department of Physics, Massachusetts Institute of Technology