Extending Superconducting Qubits Out of Plane (Part 2): Through-Silicon Vias
ORAL
Abstract
Addressing complex arrays of high coherence qubits is a necessary capability for the construction of a quantum processor. To enable high connectivity of superconducting qubits we are utilizing heterogeneous 3D integration of a qubit tier, an interposer with high-aspect-ratio superconducting through-silicon vias (TSVs), and a superconducting multi-chip module. In part 2 of this talk we will focus on the fabrication of TSVs within the interposer tier and their implementation within multi-tier stacks.
*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.
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Presenters
Justin Mallek
MIT Lincoln Laboratory
Authors
Justin Mallek
MIT Lincoln Laboratory
Jonilyn Yoder
MIT Lincoln Laboratory
MIT-Lincoln Lab
Lincoln Laboratory, Massachusetts Institute of Technology (MIT)
MIT Lincoln Lab
Donna-Ruth Yost
MIT Lincoln Laboratory
Rabindra Das
MIT Lincoln Laboratory
MIT Lincoln Laboratories
Alexandra Day
MIT Lincoln Laboratory
Massachusetts Institute of Technology MIT
Danna Rosenberg
MIT Lincoln Laboratory
MIT Lincoln Lab
MIT Lincoln Laboratories
Massachusetts Institute of Technology
Greg Calusine
MIT Lincoln Lab
MIT Lincoln Laboratory
Matthew Cook
MIT Lincoln Laboratory
Evan Golden
MIT Lincoln Laboratory
Massachusetts Institute of Technology MIT
David K Kim
MIT Lincoln Laboratory
MIT Lincoln Lab
MIT-Lincoln Lab
MIT Lincoln Laboratories
Lincoln Laboratory, Massachusetts Institute of Technology (MIT)
Massachusetts Institute of Technology (MIT) Lincoln Laboratory
Alexander Melville
MIT Lincoln Laboratory
MIT Lincoln Lab
MIT Lincoln Laboratories
Massachusetts Institute of Technology (MIT) Lincoln Laboratory
Bethany Niedzielski
MIT Lincoln Laboratory
Mollie Schwartz
MIT Lincoln Laboratory
MIT Lincoln Lab
Corey Stull
MIT Lincoln Laboratory
Sergey Tolpygo
MIT Lincoln Laboratory
Wayne Woods
MIT Lincoln Lab
MIT Lincoln Laboratory
William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn
MIT Lincoln Lab
MIT Lincoln Laboratory
MIT Lincoln Laboratory, Massachusetts Institute of Technology
Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
Research Laboratory of Electronics, Massachusetts Institute of Technology MIT
Massachusetts Institute of Technology MIT
Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory
Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology
Massachusetts Institute of Technology
Research Laboratory of Electronics, Massachusetts Institute of Technology
Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo
Physics, MIT
MIT-Lincoln Lab
MIT Lincoln Laboratories
Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog