Strong-Coupling of Hybrid Quasiparticles in Excitonic-Dielectric Gratings

ORAL

Abstract

Tightly bound exciton states in van der Waals semiconductors such as MX2 (M= Mo, W; X= S, Se) are promising for optoelectronic applications. However, to-date, strong light-exciton interaction and control of excited states in them has been limited to monolayer samples with external optical cavities. Here, we demonstrate that nanostructured multilayer WS2 provides an ideal cavity-less and exposed surface platform for exciton-photonics where the WS2 serves the role of both the cavity and the excitonic medium. We show that by patterning sub-15 nm thick WS2 into 300 nm wide resonators an avoided crossing of excitons and photon-polaritons with interaction potentials exceeding 410 meV can be engineered with precision. We further observe that inherently strong TMDC exciton absorption may be completely suppressed due to excitation of hybrid photon-exciton states and their interference. By modifying the system with dielectric spacers, we observe a rich platform for coupling and field confinement with bulk and monolayer TMDCs. Our work paves the way to a new class of integrated exciton optoelectronic nano-devices and their applications in light generation and manipulation.

*Supported by: U.S. Army Research Office, Northrop Grumman, NSF and Vagelos Institute for Energy Science and Technology.

Presenters

  • Bhaskar Abhiraman

    • Electrical and Systems Engineering, University of Pennsylvania

Authors

  • Bhaskar Abhiraman

    • Electrical and Systems Engineering, University of Pennsylvania
  • Huiqin Zhang

    • Electrical and Systems Engineering, University of Pennsylvania
    • Department of Electrical and System Engineering, University of Pennsylvania
  • Qing Zhang

    • Department of Electrical and Computer Engineering, National University of Singapore
  • Jinshui Miao

    • Electrical and Systems Engineering, University of Pennsylvania
  • Kiyoung Jo

    • Electrical and Systems Engineering, University of Pennsylvania
  • Stefano Roccasecca

    • Electrical and Systems Engineering, University of Pennsylvania
  • Mark Knight

    • Northrop Grumman Corporation
    • NG Next, Northrop Grumman Corporation
  • Artur Davoyan

    • Mechanical and Aerospace Engineering, University of California, Los Angeles
  • Deep M Jariwala

    • Electrical and Systems Engineering, University of Pennsylvania