Polymer Network Formation in Epoxy-Acrylate Dual-Cure Thermoset Resins for Direct Ink Write Additive Manufacturing

ORAL

Abstract

Dual-cure thermoset resins have been studied for many years for applications in adhesives and coatings. More recently dual-cure approaches have elicited interest for application to additive manufacturing methods such as stereolithography (SLA) and direct-ink-write (DIW). Development of methods to additively manufacture thermoset resins will enable additive approaches for a broad scope of materials including structural materials and advanced composites. The development of a dual-cure epoxy-acrylate thermoset resin for direct-ink-write AM will be described and the effect of resin composition and cure profiles on polymer network formation and final mechanical properties explored. Initial studies on the use of functionalized fillers as network crosslinkers will also be described.

*Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

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Presenters

  • Leah Appelhans

    • Organic Materials, Sandia National Laboratory

Authors

  • Leah Appelhans

    • Organic Materials, Sandia National Laboratory

  • Jessica Kopatz

    • Organic Materials, Sandia National Laboratory

  • Jaclynn Unangst

    • Organic Materials, Sandia National Laboratory

  • Adam Cook

    • Advanced Materials Laboratory, Sandia National Laboratory

  • Derek Reinholtz

    • Advanced Materials Laboratory, Sandia National Laboratory