Design, Modeling, and Measurement of Through-Silicon Via (TSV) Structures for Superconducting Quantum Computing

ORAL

Abstract

We have integrated high-aspect ratio superconducting through silicon vias (TSVs) into routing and control circuitry for superconducting qubits, as well as for dedicated grounding of on-chip ground planes, and for the elimination of chip box modes. We describe our electromagnetic modeling of TSV-embedded routing elements, and we demonstrate their incorporation into design and measurement of superconducting qubits. We also describe the robust modeling and design methodology we use to optimize the combination of compactness, electrical reflections, and dielectric losses.

*This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.

Presenters

  • Wayne Woods

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory

Authors

  • Wayne Woods

    • MIT Lincoln Lab
    • MIT Lincoln Laboratory
  • Danna Rosenberg

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
    • MIT Lincoln Laboratories
    • Massachusetts Institute of Technology
  • Mollie Schwartz

    • MIT Lincoln Laboratory
    • MIT Lincoln Lab
  • Donna Yost

    • MIT Lincoln Lab
  • Jonilyn Yoder

    • MIT Lincoln Laboratory
    • MIT-Lincoln Lab
    • Lincoln Laboratory, Massachusetts Institute of Technology (MIT)
    • MIT Lincoln Lab
  • William Oliver

    • Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn
    • MIT Lincoln Lab
    • MIT Lincoln Laboratory
    • MIT Lincoln Laboratory, Massachusetts Institute of Technology
    • Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Massachusetts Institute of Technology MIT
    • Massachusetts Institute of Technology MIT
    • Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory
    • Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology
    • Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Massachusetts Institute of Technology
    • Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo
    • Physics, MIT
    • MIT-Lincoln Lab
    • MIT Lincoln Laboratories
    • Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog