Fabrication of Sn-Cu alloy superconducting films for filled superconducting through-silicon vias
ORAL
Abstract
Quantum annealing (QA) is one of quantum computers to solve combinatorial optimization and sampling problems. We have developed new three-dimensional (3D) packaging structure, which obtain a scalability and a flexibility in the circuit size to realize customized circuits for solved problems by stacking qubit-chip, interposer, and package-substrate as much as necessary. In the 3D packaging, superconducting TSVs are necessary because generating heat in through-silicon vias (TSVs) used to connect the qubit and the package-substrate is a big problem. So far, we have fabricated superconducting TSVs with pure Sn, however, fabrication yield of the TSVs was low because it was difficult to fill the Sn in deep holes by electroplating process (EP). In this work, we have changed the material from the Sn to Sn-Cu alloy to solve the above problem. A Sn9-Cu alloy film fabricated by the EP exhibited transition temperature (Tc) of 2.4 K. Although the Tc of the Sn9-Cu alloy is about 30 % lower than that of the pure Sn, it is sufficient for our QA machine system.
*This is based on results obtained from a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO). A part of this work was conducted in Waseda University, supported by Nanotechnology Platform Program.
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Presenters
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Go Fujii
- National Institute of Advanced Industrial Science and Technology