Multilayer Microwave Integrated Quantum Circuits: Part 2

ORAL

Abstract

High-quality superconducting bonds are a critical element in constructing multilayer microwave integrated quantum circuits (MMIQCs). In order to provide lithographic precision for 3D enclosures made in wafers, it is necessary to create cavities with a high aspect ratio which places the seam in a region of high current density. In this talk, we describe a model for quantifying the loss associated with the seam, present our progress on indium bonding in microwave circuits, and discuss its application in scalable 3D superconducting quantum circuits.

*US Army Research Office grant W911NF-18-1-0212

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Presenters

  • Lev Krayzman

    • Yale Univ
    • Yale University

Authors

  • Lev Krayzman

    • Yale Univ
    • Yale University

  • Chan U Lei

    • Yale Univ
    • Yale University

  • Suhas Ganjam

    • Yale Univ
    • Yale University

  • Teresa L Brecht

    • Yale Univ, HRL Laboratories
    • Yale University & HRL

  • Christopher J Axline

    • Yale Univ
    • Yale Univ, ETH Zurich
    • Yale University & ETH
    • ETH Zurich

  • Yiwen Chu

    • Yale Univ
    • Yale University

  • Luigi Frunzio

    • Applied Physics, Yale University
    • Yale Univ
    • Yale University

  • Robert J Schoelkopf

    • Yale Univ
    • Yale University
    • Department of Applied Physics and Physics, Yale University
    • Applied Physics, Yale University