Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.

ORAL

Abstract

Quantum computing holds the potential for significantly improving computing speed relative to classical computing for selected algorithms and applications. Many researchers using transmons in a circuit QED quantum hardware architecture are producing chips with ever-increasing numbers of qubits. The corresponding increase in chip size shifts the cavity/drum resonant modes into a frequency range where qubits could be adversely affected. One solution is to implement through-silicon-vias (TSVs) and chip/cavity contact pins to supply more ground connections. We present recent microwave modeling and fabrication results on qubit chips containing membrane-covered TSVs. These flip chips are assembled using a ball-grid-array die-package interface for signal I/O.

–

Presenters

  • David Michalak

    • Components Research, Intel
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

Authors

  • David Michalak

    • Components Research, Intel
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Roman Caudillo

    • Components Research, Intel
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Lester Lampert

    • Components Research, Intel
    • Components Research, Intel Corporation
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Adel A Elsherbini

    • Components Research, Intel
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Javier A Falcon

    • DATD, Intel

  • Ye Seul Ashley Nam

    • DATD, Intel

  • Preston T Myers

    • DATD, Intel

  • Jeanette Marie Roberts

    • Components Research, Intel
    • Components Research, Intel Corporation

  • Alessandro Bruno

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Nandini Muthusubramanian

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
    • QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology

  • Cornelis Christiaan Bultink

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Filip Malinowski

    • Delft University of Technology
    • University of Copenhagen
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • Center for Quantum Devices, Niels Bohr Institute
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Nadia Haider

    • QuTech and TNO
    • QuTech and Netherlands Organisation for Scientific Research (TNO), Delft, The Netherlands

  • Leonardo DiCarlo

    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology
    • QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
    • QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology

  • Jim Clarke

    • Components Research, Intel
    • Components Research, Intel Corporation
    • Intel
    • Intel Corporation
    • Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA