Simple and Re-useable Flip-Chip Method for Hybrid Quantum Sytems

ORAL

Abstract

The flexibility and scalability of solid-state qubit systems can be greatly improved with the use of flip-chip geometries, as these provide a third dimension for interconnects and allow coupling of systems on different substrates [1,2]. Indium bump-bonded flip-chips can be prohibitively costly for a university lab, and do not offer a means to re-use the substrates. Here, we describe a simple, low cost, non-galvanic approach to flip-chip bonding, demonstrated using superconducting qubits coupled to other quantum systems, including acoustic and electromagnetic resonators. We achieve less than two microns of placement error, and provide a cryogenically-compatible bonded structure that can be disassembled using acetone. We have tested the approach using inductively coupled coplanar waveguide resonators, and we have designed a multi-qubit experiment with direct inductive coupling between qubits on separate substrates.

[1] Rosenberg, D. et al. npj Quantum Information 3, 42 (2017).
[2] Satzinger, K. J. et al. arXiv:1804.07308

*Supported by AFOSR MURI program, UChicago MRSEC (NSF DMR-1420709), and the ARL. We made use of the Pritzker Nanofabrication Facility, supported by the NSF award NNCI-1542205.

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Presenters

  • Christopher Conner

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

Authors

  • Christopher Conner

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Kevin Satzinger

    • Physics, University of California, Santa Barbara
    • University of California, Santa Barbara
    • Department of Physics, University of California, Santa Barbara
    • Department of Physics, Univerity of California, Santa Barbara
    • UC Santa Barbara; University of Chicago
    • Google Inc - Santa Barbara

  • Youpeng Zhong

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Hung-Shen Chang

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Gregory A Peairs

    • University of Chicago
    • Physics, University of California, Santa Barbara
    • University of California, Santa Barbara
    • Department of Physics, University of California, Santa Barbara
    • Department of Physics, Univerity of California, Santa Barbara
    • UC Santa Barbara; University of Chicago

  • Audrey Bienfait

    • Institute for Molecular Engineering, University of Chicago
    • University of Chicago

  • Ming-Han Chou

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Agnetta Cleland

    • Institute for Molecular Engineering, University of Chicago

  • Etienne Dumur

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Joel Grebel

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Rhys G Povey

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • Samuel Whiteley

    • University of Chicago
    • Institute for Molecular Engineering and Department of Physics, University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • David Awschalom

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago

  • David Schuster

    • University of Chicago
    • The University of Chicago
    • Physics, University of Chicago
    • Department of Physics, University of Chicago

  • Andrew N Cleland

    • University of Chicago
    • Institute for Molecular Engineering, University of Chicago