3D Printing of Functional Soft Materials and Devices

FOCUS · H49 ·






Presentations

  • ORAL

    Presenters

    • Tiberio Ezquerra

      • IEM-CSIC, Serrano 121, Madrid 28006, Spain
      • IEM-CSIC, Serrano 121, 28006 Madrid, Spain

    Authors

    • Edgar Gutierrez-Fernandez

      • IEM-CSIC, Serrano 121, 28006 Madrid, Spain
    • I.A. Gabaldon-Saucedo

      • Departament d’Enginyeria Electrònica i Biomèdica, IN2UB-Universitat de Barcelona, 08028, Barcelona, Spain.
    • M. C. Garcia-Gutierrez

      • IEM-CSIC, Serrano 121, 28006 Madrid, Spain
    • A. Varea

      • Departament d’Enginyeria Electrònica i Biomèdica, IN2UB-Universitat de Barcelona, 08028, Barcelona, Spain.
    • A. Nogales

      • IEM-CSIC, Serrano 121, Madrid 28006, Spain
      • IEM-CSIC, Serrano 121, 28006 Madrid, Spain
    • E. Rebollar

      • IQFR-CSIC, Serrano 119, Madrid 28006, Spain
    • A. Vila

      • Departament d’Enginyeria Electrònica i Biomèdica, IN2UB-Universitat de Barcelona, 08028, Barcelona, Spain.
    • A. Cirera

      • Departament d’Enginyeria Electrònica i Biomèdica, IN2UB-Universitat de Barcelona, 08028, Barcelona, Spain.
    • Tiberio Ezquerra

      • IEM-CSIC, Serrano 121, Madrid 28006, Spain
      • IEM-CSIC, Serrano 121, 28006 Madrid, Spain

    View abstract →

  • ORAL

    Presenters

    • Hongxia Li

      • Mechanical Engineering Department, Masdar Institute, Khalifa University

    Authors

    • Hongxia Li

      • Mechanical Engineering Department, Masdar Institute, Khalifa University
    • Aikifa Raza

      • Mechanical Engineering Department, Masdar Institute, Khalifa University
    • Afra Alketbi

      • Mechanical Engineering Department, Masdar Institute, Khalifa University
    • TieJun Zhang

      • Mechanical Engineering Department, Masdar Institute, Khalifa University

    View abstract →

  • ORAL

    Presenters

    • Anna Smallwood-Rooney

      • Rensselaer Polytechnic Institute

    Authors

    • Anna Smallwood-Rooney

      • Rensselaer Polytechnic Institute
    • Rykelle Adley

      • Rensselaer Polytechnic Institute
    • Adam Merkle

      • Rensselaer Polytechnic Institute
    • Keith DeNivo

      • Rensselaer Polytechnic Institute
    • Sungmin Park

      • Rensselaer Polytechnic Institute
    • Chang Yeol Ryu

      • Rensselaer Polytechnic Institute

    View abstract →

  • ORAL

    Presenters

    • Lin Lei

      • Mechanical and Aerospace Engineering, Rutgers University

    Authors

    • Lin Lei

      • Mechanical and Aerospace Engineering, Rutgers University
    • Dylan A. Kovacevich

      • Mechanical and Aerospace Engineering, Rutgers University
    • Christianna Kuznetsova

      • Mechanical and Aerospace Engineering, Rutgers University
    • Jonathan Singer

      • Mechanical and Aerospace Engineering, Rutgers University

    View abstract →

  • ORAL

    Presenters

    • Zihao Gong

      • Materials Science and Engineering, University of Virginia

    Authors

    • Zihao Gong

      • Materials Science and Engineering, University of Virginia
    • Shifeng Nian

      • Materials Science and Engineering, University of Virginia
    • Liheng Cai

      • Materials Science and Engineering and Chemical Engineering, University of Virginia
      • Materials Science and Engineering, university of virginia
      • Department of Physics & SEAS, Harvard University

    View abstract →