Phonon dynamics and thermal conductivity at the nanoscale

FOCUS · F15 ·






Presentations

  • Invited

    Presenters

    • David Cahill

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana-Campaign
      • University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana–Champaign
      • Department of Materials Science and Engineering and Materials Research Laboratory, Univ of Illinois - Urbana
      • Univ of Illinois - Urbana
      • Univ of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois

    Authors

    • David Cahill

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana-Campaign
      • University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana–Champaign
      • Department of Materials Science and Engineering and Materials Research Laboratory, Univ of Illinois - Urbana
      • Univ of Illinois - Urbana
      • Univ of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois
    • Xu Xie

      • Univ of Illinois at Urbana-Champaign

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  • ORAL

    Presenters

    • Jungwoo Shin

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign

    Authors

    • Jungwoo Shin

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • Jaeuk Sung

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • Minjee Kang

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • Byeongdu Lee

      • X-ray Science Division, Argonne Natl Lab
      • Advanced Photon Source, Argonne National Laboratory
      • Argonne National Laboratory
      • X-ray Science Division, Argonne National Laboratory
    • Cecilia Leal

      • Materials Science and Engineering, U. of Illinois, Urbana-Champaign
      • Univ of Illinois - Urbana
      • University of Illinois at Urbana-Champaign
      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • Nancy Sottos

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • Paul Braun

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
    • David Cahill

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana-Campaign
      • University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana–Champaign
      • Department of Materials Science and Engineering and Materials Research Laboratory, Univ of Illinois - Urbana
      • Univ of Illinois - Urbana
      • Univ of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois

    View abstract →

  • ORAL

    Presenters

    • ELLA PEK

      • Univ of Illinois - Urbana

    Authors

    • ELLA PEK

      • Univ of Illinois - Urbana
    • Xi Chen

      • University of Texas, at Austin
    • Sean Sullivan

      • University of Texas, at Austin
    • Jianshi Zhou

      • Univ of Texas
      • University of Texas
      • University of Texas at Austin
      • Texas Materials Institute, University of Texas at Austin
      • Univ of Texas, Austin
      • Mechanical Engineering, University of Texas at Austin
      • University of Texas, at Austin
    • Li Shi

      • University of Texas at Austin
      • University of Texas, at Austin
    • David Cahill

      • Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana-Campaign
      • University of Illinois at Urbana-Champaign
      • University of Illinois at Urbana–Champaign
      • Department of Materials Science and Engineering and Materials Research Laboratory, Univ of Illinois - Urbana
      • Univ of Illinois - Urbana
      • Univ of Illinois at Urbana-Champaign
      • Department of Materials Science and Engineering, University of Illinois

    View abstract →

  • ORAL

    Presenters

    • Dengyu Yang

      • Univ of Pittsburgh

    Authors

    • Dengyu Yang

      • Univ of Pittsburgh
    • Yun-Yi Pai

      • Physics, Univ of Pittsburgh
      • Univ of Pittsburgh
      • Department of Physics and Astronomy, University of Pittsburgh
    • Yuhe Tang

      • Physics and Astronomy, University of Pittsburgh
      • Department of Physics and Astronomy, University of Pittsburgh
      • Univ of Pittsburgh
    • Yang Hu

      • Univ of Pittsburgh
    • Hyungwoo Lee

      • University of Wisconsin-Madison
      • Univ of Wisconsin-Madison
      • University of Wisconsin
      • University of Wisconsin–Madison
      • Department of Materials Science and Engineering, University of Wisconsin-Madison
      • Physics, University of Wisconsin–Madison
      • Department of Materials Science and Engineering, University of Wisconsin - Madison
    • Jung-Woo Lee

      • Univ of Wisconsin-Madison
      • University of Wisconsin-Madison
      • University of Wisconsin
      • University of Wisconsin–Madison
      • Physics, University of Wisconsin–Madison
      • Department of Materials Science and Engineering, University of Wisconsin-Madison
    • Chang-Beom Eom

      • University of Wisconsin-Madison
      • Univ of Wisconsin-Madison
      • Univ of Wisconsin, Madison
      • Department of Material Science and Engineering, University of Wisconsin-Madison
      • Matls Sci & Eng, University of Wisconsin-Madison
      • University of Wisconsin
      • Department of Materials Science and Engineering, University of Wisconsin-Madison
      • University of Wisconsin–Madison
      • MS&E, University of Wisconsin
      • Physics, University of Wisconsin–Madison
      • Department of Materials Science and Engineering, University of Wisconsin - Madison
    • Patrick Irvin

      • Univ of Pittsburgh
      • University of Pittsburgh
      • Physics and Astronomy, University of Pittsburgh
      • Department of Physics and Astronomy, Univ of Pittsburgh
      • Department of Physics and Astronomy, University of Pittsburgh
      • Physics, University of Pittsburgh
      • Physics and Astronomy, Univ of Pittsburgh
    • Jeremy Levy

      • Univ of Pittsburgh
      • Physics, Univ of Pittsburgh
      • University of Pittsburgh
      • Physics and Astronomy, University of Pittsburgh
      • Department of Physics and Astronomy, Univ of Pittsburgh
      • Department of Physics and Astronomy, University of Pittsburgh
      • Physics, University of Pittsburgh
      • Physics and Astronomy, Univ of Pittsburgh

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  • ORAL

    Presenters

    • Gabriel Jaffe

      • Physics, Univ of Wisconsin-Madison

    Authors

    • Gabriel Jaffe

      • Physics, Univ of Wisconsin-Madison
    • Song Mei

      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Colin Boyle

      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Jeremy Kirch

      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Irena Knezevic

      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Dan Botez

      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Luke Mawst

      • Electrical and Computer Engineering, University of Wisconsin-Madison
      • Electrical and Computer Engineering, Univ Wisconsin-Madison
    • Max Lagally

      • University of Wisconsin-Madison
      • Materials Science and Engineering, University of Wisconsin: Madison
      • Materials Science and Engineering, Univ of Wisconsin-Madison
    • Mark Eriksson

      • Univ of Wisconsin, Madison
      • Department of Physics, Univ of Wisconsin, Madison
      • Physics, Univ of Wisconsin-Madison

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  • ORAL

    Presenters

    • Erika Ye

      • Applied Physics, California Institute of Technology

    Authors

    • Erika Ye

      • Applied Physics, California Institute of Technology
    • Austin Minnich

      • California Institute of Technology
      • Division of Engineering and Applied Science, California Institute of Technology
      • Caltech
      • Mechanical and Civil Engineering, California Institute of Technology
      • Mechanical Engineering, California Institute of Technology
      • Division of Engineering and Applied Science, Caltech

    View abstract →

  • ORAL

    Presenters

    • Fariborz Kargar

      • Department of Electrical and Computer Engineering/Materials Science and Engineering Program, University of California, Riverside
      • Electrical and Computer Engineering, University of California, Riverside
      • Electrical and Computer Engineering, University of California Riverside

    Authors

    • Fariborz Kargar

      • Department of Electrical and Computer Engineering/Materials Science and Engineering Program, University of California, Riverside
      • Electrical and Computer Engineering, University of California, Riverside
      • Electrical and Computer Engineering, University of California Riverside
    • Elias Penilla

      • Department of Mechanical and Aerospace Engineering, University of California, San Diego
    • Ece Aytan

      • Electrical and computer Engineering, Univ of California - Riverside
      • Department of Electrical and Computer Engineering, University of California, Riverside
      • Electrical and Computer Engineering, University of California, Riverside
      • Material Science and Engineering, University of California Riverside
    • Jacob Lewis

      • Department of Electrical and Computer Engineering/Materials Science and Engineering Program, University of California, Riverside
      • Electrical and Computer Engineering, University of California, Riverside
    • Ruben Salgado

      • Electrical and Computer Engineering, University of California, Riverside
    • Javier Garay

      • Mechanical & Aerospace Engineering, University of California, San Diego
      • Department of Mechanical and Aerospace Engineering, University of California, San Diego
    • Alexander Balandin

      • Electrical and Computer Engineering , University of California
      • Electrical and Computer Engineering, University of California Riverside
      • Electrical and computer Engineering, Univ of California - Riverside
      • Department of Electrical and Computer Engineering/Materials Science and Engineering Program, University of California, Riverside
      • Department of Electrical and Computer Engineering, University of California, Riverside
      • Electrical and Computer Engineering, University of California, Riverside
      • University of California Riverside

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  • ORAL

    Presenters

    • Masato Ohnishi

      • Department of Mechanical Engineering, The University of Tokyo

    Authors

    • Masato Ohnishi

      • Department of Mechanical Engineering, The University of Tokyo
    • Junichiro Shiomi

      • Department of Mechanical Engineering, The University of Tokyo
      • Univ of Tokyo

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  • ORAL

    Presenters

    • Young-Dahl Jho

      • School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology
      • Gwangju Inst of Sci & Tech

    Authors

    • Young-Dahl Jho

      • School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology
      • Gwangju Inst of Sci & Tech
    • Hoonil Jeong

      • Gwangju Inst of Sci & Tech
    • Austin Minnich

      • California Institute of Technology
      • Division of Engineering and Applied Science, California Institute of Technology
      • Caltech
      • Mechanical and Civil Engineering, California Institute of Technology
      • Mechanical Engineering, California Institute of Technology
      • Division of Engineering and Applied Science, Caltech
    • Christopher Stanton

      • Univ of Florida - Gainesville
      • Physics, Univ of Florida - Gainesville
      • University of Florida

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  • ORAL

    Presenters

    • Ognjen Ilic

      • California Institute of Technology

    Authors

    • Ognjen Ilic

      • California Institute of Technology
    • Nathan Thomas

      • California Institute of Technology
    • Thomas Christensen

      • Massachusetts Institute of Technology
    • Michelle Sherrott

      • California Institute of Technology
    • Marin Soljacic

      • Physics, MIT
      • MIT
      • Massachusetts Institute of Technology
    • Austin Minnich

      • California Institute of Technology
      • Division of Engineering and Applied Science, California Institute of Technology
      • Caltech
      • Mechanical and Civil Engineering, California Institute of Technology
      • Mechanical Engineering, California Institute of Technology
      • Division of Engineering and Applied Science, Caltech
    • Owen Miller

      • Yale University
    • Harry Atwater

      • Caltech
      • Applied Physics and Materials Science, California Institute of Technology
      • California Institute of Technology
      • Thomas J. Watson Laboratory of Applied Physics, California Institute of Technology
      • Applied Physics and Material Science, Caltech
      • Thomas J. Watson Laboratories of Applied Physics, California Institute of Technology
      • Applied Physics and Materials Sciences, California Institute of Technology
      • Applied Physics and Material Science, California Institute of Technology

    View abstract →