Probing voltage induced bond rupture in a molecular junction
ORAL
Abstract
We use scanning tunneling microscope break junction to study electric field breakdown at the single molecule level. We investigate breakdown phenomena in atomic chains composed of Si---Si, Si---O, Si---C, Ge---Ge and C---C bonds that are commonly found in the low-$\kappa$ dielectric material. We see different bond rupture behaviors in a range of molecular backbones, and use the results from a statistically large number of measurements to determine which bond breaks. We find that Si---Si and Ge---Ge bonds rupture above a 1V bias. We also find that the Si---C bond is more robust than Si---O or Si---Si bond at above 1V. Finally, we illustrate how an additional conductance pathway in parallel to the Si---Si bond changes bond rupture behavior under an electric field. We carry out ab initio calculations on these systems and demonstrate that the mechanism for bond rupture under electric field involves {\lq\lq}heating{\rq\rq} of the molecule through electron-vibrational mode coupling.
*Haixing Li is supported by Semiconductor Research Corporation and New York CAIST program. We thank the NSF for the support of these studies under grant no. CHE-1404922.