Heat Removal with Graphene Lateral Heat Spreaders

ORAL

Abstract

Device downscaling leads to higher chip power densities. A possible approach for heat removal from the localized hot spots is incorporation to chips of materials with high thermal conductivity. Recently, graphene and few-layer graphene (FLG) were proposed for heat removal owing to their superior thermal conductivity [1]. To evaluate the feasibility of this approach we simulated numerically heat propagation in SOI-based chip with and without graphene layers. It was found that incorporation of graphene or FLG can lead to substantial reduction of the hot spot's temperature [2]. The obtained results and are important for the design of graphene heat spreaders and interconnects [3]. \\[4pt] [1] A.A. Balandin, et al., Nano Lett., 8, (2008); S. Ghosh, et al., Appl. Phys. Lett., 92, (2008) \\[0pt] [2] S. Subrina, et al., Electron Dev. Lett., December (2009) \\[0pt] [3] A.A. Balandin, ``New materials can keep chips cool,'' IEEE Spectrum, October 2009

*The work at UCR was supported by DARPA - SRC through FENA and IFC.

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Authors

  • S. Subrina

    • Nano-Device Laboratory, Department of Electrical Engineering, University of California – Riverside, Riverside, CA 92521

  • D. Kotchetkov

    • Nano-Device Laboratory, Department of Electrical Engineering, University of California – Riverside, Riverside, CA 92521

  • S. Ghosh

    • Department of Electrical Engineering, University of California-Riverside, CA 92521
    • Nano-Device Laboratory, Department of Electrical Engineering, University of California – Riverside, Riverside, CA 92521

  • A.A. Balandin

    • Department of Electrical Engineering, University of California - Riverside
    • University of California - Riverside
    • Nano-Device Laboratory, Department of Electrical Engineering, University of California – Riverside, Riverside, CA 92521