Plasma Etching III

Presentations

• Plasma sheath tailoring for advanced 3D plasma etching: the effects of mask geometry, etching materials, and ion energy.

  ORAL

  Oct. 16, 2025, 2:00 PM – Oct. 16, 2025, 2:15 PM

  Publication: Jüngling et al. Appl. Phys. Lett. 12 February 2024; 124 (7): 074101.

  Presenters

  • Elia Jüngling

    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  Authors

  • Elia Jüngling

    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  • Meret Nürnberg

    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  • Gerardo Emiliano Gutierrez Alvarez

    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  • Marc Böke

    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  • Achim von Keudell

    • Experimental Physics II, Ruhr-University Bochum, Bochum, GERMANY
    • Experimental Physics II - Reactive Plasmas, Ruhr University Bochum, Germany

  View abstract →

• Deep Potential Molecular Dynamics Simulations of Ion-Enhanced Etching of Silicon by Atomic Chlorine

  ORAL

  Oct. 16, 2025, 2:15 PM – Oct. 16, 2025, 2:30 PM

  Presenters

  • Andreas Kounis-Melas

    • Princeton University

  Authors

  • Andreas Kounis-Melas

    • Princeton University

  • Athanassios Z Panagiotopoulos

    • Princeton University

  • David Barry Graves

    • Chemical & Biological Engineering Princeton University

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• Atomic layer etching of sputter-deposited AlN in Cl2-Ar plasmas

  ORAL

  Oct. 16, 2025, 2:30 PM – Oct. 16, 2025, 2:45 PM

  Presenters

  • Iurii Nesterenko

    • Silicon Austria Labs GmbH; Ruhr-University Bochum

  Authors

  • Iurii Nesterenko

    • Silicon Austria Labs GmbH; Ruhr-University Bochum

  • Jon Farr

    • Applied Materials, Inc.

  • Steffen Harzenetter

    • Applied Materials, Inc.

  • Dmytro Solonenko

    • Silicon Austria Labs GmbH

  • Benjamin Kalas

    • Silicon Austria Labs GmbH

  • Thang Dao

    • Silicon Austria Labs GmbH

  • Julian Schulze

    • Chair of Applied Electrodynamics and Plasma Technology, Ruhr University Bochum, Bochum, Germany

  • Nikolai Andrianov

    • Austria Labs GmbH

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• Modeling and optimization of plasma chemical etching of polysilicon in HBr/Cl2 mixture with data-driven approaches

  ORAL

  Oct. 16, 2025, 2:45 PM – Oct. 16, 2025, 3:00 PM

  Presenters

  • Fedor V Oksanichenko

    • Moscow Institute of Physics and Technology

  Authors

  • Fedor V Oksanichenko

    • Moscow Institute of Physics and Technology

  • Alexander Efremov

    • JSC MERI

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• The effect of quenching process for the argon excited states in plasma etching

  ORAL

  Oct. 16, 2025, 3:00 PM – Oct. 16, 2025, 3:15 PM

  Presenters

  • Lu Wang

    • Harbin Institute of Technology

  Authors

  • Lu Wang

    • Harbin Institute of Technology

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• Ion Energy Distribution Function (IEDF) Simulation Applicable to Customized Bias Voltage Waveform

  ORAL

  Oct. 16, 2025, 3:15 PM – Oct. 16, 2025, 3:30 PM

  Presenters

  • HyeonHo Nahm

    • Hanyang University

  Authors

  • HyeonHo Nahm

    • Hanyang University

  • Chin-Wook Chung

    • Department of electrical engineering, Hanyang University, Seoul, Korea1
    • Hanyang University

  View abstract →