Plasma Surface Interaction II

FOCUS · DR2 · ID: 1531258





Presentations

  • ORAL

    Presenters

    • Byungjo Kim

      • Mechatronics Research, Samsung Electronics

    Authors

    • Byungjo Kim

      • Mechatronics Research, Samsung Electronics
    • Seokjun Hong

      • Mechatronics Research, Samsung Electronics
    • Hyunhak Jeong

      • Mechatronics Research, Samsung Electronics
    • Suyoung Yoo

      • Mechatronics Research, Samsung Electronics
    • Seongkeun Cho

      • Mechatronics Research, Samsung Electronics
    • Sang Ki Nam

      • Samsung Electronics Co. Ltd.
      • Mechatronics Research, Samsung Electronics
    • Yihwan Kim

      • Mechatronics Research, Samsung Electronics

    View abstract →

  • ORAL

    Publication: Plann: Hybrid Molecular Dynamics-Machine Learning Approach for Efficient Modeling of Particle Growth in Non-Thermal Plasma

    Presenters

    • Paolo Elvati

      • Department of Chemical Engineering, University of Michigan, Ann Arbor, MI

    Authors

    • Paolo Elvati

      • Department of Chemical Engineering, University of Michigan, Ann Arbor, MI
    • Jacob Saldinger

      • Department of Chemical Engineering, University of Michigan, Ann Arbor, MI
    • Matt Raymond

      • Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI
    • Jonathan Lin

      • Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI
    • Angela Violi

      • Department of Chemical Engineering; Department of Mechanical Engineering; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI
    • Xuetao Shi

      • Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI

    View abstract →

  • ORAL · Invited

    Publication: T. Gergs, T. Mussenbrock, and J. Trieschmann, Sci. Rep. 13, 5287 (2023).
    T. Gergs, T. Mussenbrock, and J. Trieschmann, J. Phys. D: Appl. Phys. 56, 194001 (2023).
    T. Gergs, T. Mussenbrock, and J. Trieschmann, J. Phys. D: Appl. Phys. 56, 084003 (2023).
    T. Gergs, T. Mussenbrock, and J. Trieschmann, J. Appl. Phys. 132, 063302 (2022).
    T. Gergs, B. Borislavov, and J. Trieschmann, J. Vac. Sci. Technol. B 40, 012802 (2022).
    T. Gergs, F. Schmidt, T. Mussenbrock, and J. Trieschmann, J. Chem. Theory Comput. 17, 6691-6704 (2021).
    F. Krüger, T. Gergs, and J. Trieschmann, Plasma Sources Sci. Technol. 28, 035002 (2019).

    Presenters

    • Tobias Gergs

      • Ruhr University Bochum

    Authors

    • Tobias Gergs

      • Ruhr University Bochum
    • Thomas Mussenbrock

      • Ruhr University Bochum, 44780 Bochum, Germany
      • Ruhr University Bochum
    • Luca Vialetto

      • Kiel University
    • Jan Trieschmann

      • Kiel University

    View abstract →

  • ORAL

    Presenters

    • Pedro Viegas

      • Instituto Superior Técnico - Universidade de Lisboa

    Authors

    • Pedro Viegas

      • Instituto Superior Técnico - Universidade de Lisboa
    • José Afonso

      • Instituto Superior Técnico - Universidade de Lisboa
    • Jorge Silveira

      • Instituto Superior Técnico - Universidade de Lisboa
    • Tiago C Dias

      • Instituto de Plasmas e Fusão Nuclear, Universidade de Lisboa
      • Instituto de Plasmas e Fusão Nuclear, Instituto Superior Técnico, Universidade de Lisboa
      • Instituto Superior Técnico
    • Ana Sofía Morillo Candás

      • Laboratoire de Physique des Plasmas
    • Luca Vialetto

      • Kiel University
    • Vasco Guerra

      • Instituto de Plasmas e Fusão Nuclear, Instituto Superior Técnico, Universidade de Lisboa, Portugal
      • Instituto de Plasmas e Fusão Nuclear, Instituto Superior Técnico, Universidade de Lisboa
      • Instituto Superior Tecnico

    View abstract →

  • ORAL

    Presenters

    • Varanasi Sai Subhankar

      • The University of Texas at Austin
      • The University of Texas at Austin - Department of Aerospace Engineering

    Authors

    • Varanasi Sai Subhankar

      • The University of Texas at Austin
      • The University of Texas at Austin - Department of Aerospace Engineering
    • Charan R Nallapareddy

      • The University of Texas at Austin
      • University of Texas at Austin
    • Thomas C Underwood

      • University of Texas at Austin

    View abstract →