Workshop I: Industrial Plasma Technologies

Presentations

• Modeling and Simulation of Plasmas for Etch Applications

  ORAL · Invited

  Oct. 3, 2022, 10:30 AM – Oct. 3, 2022, 11:15 AM

  Presenters

  • Jason Kenney

    • Applied Materials Inc

  Authors

  • Jason Kenney

    • Applied Materials Inc

  • Shahid Rauf

    • Applied Materials Inc, USA
    • Applied Materials Inc
    • Applied Materials
    • Applied Materials Inc.

  • Samaneh Sadighi

    • Applied Materials

  • Peng Tian

    • Applied Materials Inc, USA
    • Applied Materials Inc.
    • Applied Materials Inc

  • Han Luo

    • Applied Materials Inc

  View abstract →

• Thermal cyclic atomic-level etching in 3D ULSI device fabrication

  ORAL · Invited

  Oct. 3, 2022, 11:15 AM – Oct. 3, 2022, 12:00 PM

  Presenters

  • Hiroto Ohtake

    • Hitachi High-Tech Corporation

  Authors

  • Hiroto Ohtake

    • Hitachi High-Tech Corporation

  View abstract →

• Lunch

  COFFEE_KLATCH · Invited

  Oct. 3, 2022, 12:00 PM – Oct. 3, 2022, 1:30 PM

  View abstract →

• New challenges on semiconductor plasma manufacturing processes

  ORAL · Invited

  Oct. 3, 2022, 1:30 PM – Oct. 3, 2022, 2:15 PM

  Presenters

  • Tsuyoshi Moriya

    • Tokyo Electron Limited

  Authors

  • Tsuyoshi Moriya

    • Tokyo Electron Limited

  View abstract →

• Applications of plasma-enhanced deposition technologies in the semiconductor industry

  ORAL · Invited

  Oct. 3, 2022, 2:15 PM – Oct. 3, 2022, 3:00 PM

  Presenters

  • Jaeho Kim

    • SAMSUNG ELECTRONICS Co., Ltd.

  Authors

  • Jaeho Kim

    • SAMSUNG ELECTRONICS Co., Ltd.

  View abstract →

• Coffee Break

  COFFEE_KLATCH · Invited

  Oct. 3, 2022, 3:00 PM – Oct. 3, 2022, 3:30 PM

  View abstract →

• Quantitative Control of Plasma and Surface Reactions for Dielectric Film Etching

  ORAL · Invited

  Oct. 3, 2022, 3:30 PM – Oct. 3, 2022, 4:15 PM

  Publication: [1] T. Tatsumi, et al., Jpn. J. Appl. Phys. 37, 2394 (1998).
  [2] T. Tatsumi, et al., J. Vac. Sci. Technol. A23, 938 (2005).
  [3] T. Kimura, et al., J. Vac. Sci. Technol. A23, 1068 (2007).
  [4] Y. Nakamura., et al., J. Vac. Sci. Technol. A25, 1062 (2007).
  [5] T. Tatsumi, Jpn. J. Appl. Phys. 61, SA0804 (2022).

  Presenters

  • Tetsuya Tatsumi

    • Sony Semiconductor Solutions Corporation

  Authors

  • Tetsuya Tatsumi

    • Sony Semiconductor Solutions Corporation

  View abstract →

• Plasma for a clean and carbon-neutral world

  ORAL · Invited

  Oct. 3, 2022, 4:15 PM – Oct. 3, 2022, 5:00 PM

  Presenters

  • Dae Hoon Lee

    • Korea Institute of Machinery and Materials

  Authors

  • Dae Hoon Lee

    • Korea Institute of Machinery and Materials

  • Hongjae Kang

    • Korea Institute of Machinery and Materials

  • Youna Kim

    • Korea Institute of Machinery and Materials

  • Heesoo Lee

    • Korea Institute of Machinery and Materials

  • Hohyun Song

    • Korea Institute of Machinery and Materials

  • Jeongan Choi

    • Korea Institute of Machinery and Materials

  • Kwan-Tae Kim

    • Korea Institute of Machinery and Materials

  • Young-Hoon Song

    • Korea Institute of Machinery and Materials

  View abstract →