Multiscale transport modeling of reactive sputtering for fabrication of neuromorphic hardware

ORAL

Abstract

Conventional computer technology is facing scaling limitations related to hardware architecture and power consumption. To overcome these limitations, memristive devices are currently under investigation in neuromorphic hardware that draws inspiration from biological principles. However, the reliable fabrication of memristive devices remains challenging, as the variation of electrical device properties is often severe. In particular, characteristics of devices have shown a strong correlation with plasma parameters used for deposition of thin films. In this work, a multiscale model for reactive sputter deposition of metal oxides is used to complement the experiments and assess the quantities that mainly influence the resulting properties of the deposited films. The model relates on a hybrid scheme for the plasma, test-particle simulations for the sputtered particle transport, and a kinetic Monte Carlo model for thin film growth. As a results of the study, the main plasma parameters, such as electron temperature and distribution of energetic ions, and their relation with electrical properties of the memristive devices produced on one wafer are presented.

*Funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) - Project-ID 434434223 - SFB 1461.

Publication: Multiscale transport modeling of reactive sputtering for fabrication of neuromorphic hardware, L. Vialetto, R. Lamprecht, C. Stuewe, T. Hemke, F. Zahari, H. Kohlstedt, T. Mussenbrock, J. Trieschmann, in preparation

Presenters

  • Luca Vialetto

    • Theoretical Electrical Engineering, Faculty of Engineering, Kiel University
    • Kiel University

Authors

  • Luca Vialetto

    • Theoretical Electrical Engineering, Faculty of Engineering, Kiel University
    • Kiel University
  • Rouven Lamprecht

    • Nanoelectronics, Faculty of Engineering, Kiel University,
  • Christian Stuewe

    • Theoretical Electrical Engineering, Faculty of Engineering, Kiel University
  • Torben Hemke

    • Applied Electrodynamics and Plasma Technology, Department of Electrical Engineering and Information Sciences, Ruhr Uni­ver­si­ty Bo­chum
  • Finn Zahari

    • Nanoelectronics, Faculty of Engineering, Kiel University
  • Hermann Kohlstedt

    • Nanoelectronics, Faculty of Engineering, Kiel University
  • Thomas Mussenbrock

    • Ruhr University Bochum
    • Bochum University
    • Ruhr-Uni­ver­si­tät Bo­chum
    • Applied Electrodynamics and Plasma Technology, Department of Electrical Engineering and Information Sciences, Ruhr Uni­ver­si­ty Bo­chum
  • Jan Trieschmann

    • Kiel University
    • Christian-Albrechts-Universität zu Kiel
    • Theoretical Electrical Engineering, Faculty of Engineering, Kiel University