Plasma-Surface Interactions I (Etching)
FOCUS · DT3 ·
Presentations
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Surface reaction control of plasma etch for atomic level accuracy in ULSI devices fabrication
COFFEE_KLATCH · Invited
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Authors
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Masaru Izawa
- Hitachi High-Technologies Corp.
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Dynamics of surface ripple formation and propagation during plasma etching
ORAL
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Authors
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Kouichi Ono
- Kyoto Univ
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Plasma Parameters in an Ar and Ar/Cl$_{\mathrm{2\thinspace }}$Asymmetric Coaxial CCP Used for Plasma Etching of Superconducting Niobium Cavities.
ORAL
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Authors
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Jeremy Peshl
- Old Dominion University
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Milka Nikolic
- University of San Francisco
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Alex Godunov
- Old Dominion University
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Svetozar Popovic
- Old Dominion University
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Lepsha Vuskovic
- Old Dominion University
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