Plasma Etching for Semiconductor Processing
FOCUS · ET3 ·
Presentations
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Etching for New Devices
COFFEE_KLATCH · Invited
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Authors
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Keizo Kinoshita
- Photonics Electronics Technology Research Association
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Cryogenic etching: A solution for damage-free narrow trench etching
ORAL
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Authors
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Quanzhi Zhang
- University of Antwerp
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Stefan Tinck
- University of Antwerp
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Annemie Bogaerts
- University of Antwerp
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Machine Learning of Micro/macro Cavity Data for Etching Recipe Optimization
ORAL
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Authors
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Hyakka Nakada
- Hitachi, Ltd. Research & Development Group
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Masaru Kurihara
- Hitachi, Ltd. Research & Development Group
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Masayoshi Ishikawa
- Hitachi, Ltd. Research & Development Group
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Tatehito Usui
- Hitachi, Ltd. Research & Development Group
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Naoyuki Kofuji
- Hitachi, Ltd. Research & Development Group
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Takeshi Ohmori
- Hitachi, Ltd. Research & Development Group
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Atomic Layer Etch: A Concurrent Plasma Modeling and Process Approach
COFFEE_KLATCH · Invited
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Authors
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Mingmei Wang
- TEL Technology Center, America LLC
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Selective Etching by Tailored RF Ion Energy Control Using Frequency/Phase Locked RF Power Delivery
ORAL
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Authors
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Yusuke Yoshida
- TEL Technology Center, America, LLC
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David Coumou
- MKS Instruments, Inc.
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Scott White
- MKS Instruments, Inc.
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Steven Shannon
- North Carolina State University
- Nuclear Engineering Department, North Carolina State University
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Sergey Voronin
- TEL Technology Center, America, LLC
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Alok Ranjan
- Tokyo Electron Miyagi, Ltd.
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VUV Broad-Band absorption spectroscopy in downstream plasma soft-etch reactor
ORAL
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Authors
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Robert Soriano Casero
- LTM
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Laurent Vallier
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Gilles Cunge
- LTM
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Nader Sadeghi
- LTM
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