Plasma Etching II

Presentations

• Cryogenic Etching for Sub-10 nm Patterning for Bit Patterned Media Fabrication

  COFFEE_KLATCH · Invited

  Oct. 16, 2015, 10:00 AM – Oct. 16, 2015, 10:30 AM

  Authors

  • Deirdre Olynick

    • Lawrence Berkeley National Laboratory

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• Atomic Layer Etch to Escape Aspect Ratio Dependent Etching-Profile-Selectivity Trade-offs in Plasma Etch

  ORAL

  Oct. 16, 2015, 10:30 AM – Oct. 16, 2015, 10:45 AM

  Authors

  • Alok Ranjan

    • TEL Technology Center, America, LLC
    • TEL Technology Center, America, LLC.

  • Mingmei Wang

    • TEL Technology Center, America, LLC

  • Sonam Sherpa

    • TEL Technology Center, America, LLC

  • Peter Ventzek

    • Tokyo Electron America, Inc.

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• Low Damage Etching with Atomic Layer Precision

  ORAL

  Oct. 16, 2015, 10:45 AM – Oct. 16, 2015, 11:00 AM

  Authors

  • L. Dorf

    • Applied Materials

  • Shahid Rauf

    • Applied Materials
    • Applied Materials, Sunnyvale, CA

  • G. Monroy

    • Applied Materials

  • K. Ramaswamy

    • Applied Materials

  • K. Collins

    • Applied Materials

  • Y. Zhang

    • Applied Materials

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• Layer by layer etching of LaAlSiOx

  ORAL

  Oct. 16, 2015, 11:00 AM – Oct. 16, 2015, 11:15 AM

  Authors

  • Mitsuhiro Omura

    • Toshiba Corporation

  • Kazuhito Furumoto

    • Toshiba Corporation

  • Kazuhisa Matsuda

    • Toshiba Corporation

  • Toshiyuki Sasaki

    • Toshiba Corporation

  • Itsuko Sakai

    • Toshiba Corporation

  • Hisataka Hayashi

    • Toshiba Corporation

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• Cryogenic etching of Si with SF$_{6}$/O$_{2}$: a modeling and experimental study

  ORAL

  Oct. 16, 2015, 11:15 AM – Oct. 16, 2015, 11:30 AM

  Authors

  • Stefan Tinck

    • University of Antwerp

  • Erik C. Neyts

    • University of Antwerp

  • Thomas Tillocher

    • University of Orleans

  • Remi Dussart

    • University of Orleans

  • Annemie Bogaerts

    • University of Antwerp

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• Etching of GaAs materials by chlorine neutral beam for quantum nanodisks fabrication

  ORAL

  Oct. 16, 2015, 11:30 AM – Oct. 16, 2015, 11:45 AM

  Authors

  • Cedric Thomas

    • Tohoku University

  • Akio Higo

    • Tohoku University

  • Takeru Okada

    • Tohoku University
    • Institute of Fluid Science, Tohoku University

  • Seiji Samukawa

    • Tohoku University

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• Etching of Magnetic Tunneling Junctions Materials using a Reactive Ion Beam

  ORAL

  Oct. 16, 2015, 11:45 AM – Oct. 16, 2015, 12:00 PM

  Authors

  • Kyung Chae Yang

    • SungKyunKwan University

  • Sung Woo Park

    • SungKyunKwan University

  • Min Hwan Jeon

    • SungKyunKwan University

  • Geun Young Yeom

    • SungKyunKwan University

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• Dry Etching of Si$_{3}$N$_{4}$, SiO$_{2}$ and Si Using Remote Plasma Sources Sustained in NF$_{3}$ Mixtures

  ORAL

  Oct. 16, 2015, 12:00 PM – Oct. 16, 2015, 12:15 PM

  Authors

  • Shuo Huang

    • U. Michigan

  • Vladimir Volynets

    • Samsung Electronics Ltd.

  • Sangheon Lee

    • Samsung Electronics Ltd.

  • In-Cheol Song

    • Samsung Electronics Ltd.

  • Siqing Lu

    • Samsung Electronics Ltd.

  • James Hamilton

    • U. College London

  • Jonathan Tennyson

    • U. College London

  • Mark J. Kushner

    • University of Michigan
    • U. Michigan
    • University of Michigan EECE

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