Advanced RF Systems for Plasma Control

Presentations

• Introduction

  COFFEE_KLATCH

  Nov. 3, 2014, 8:00 AM – Nov. 3, 2014, 8:15 AM

  Authors

  • David Coumou

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• Time-Modulated Inductively Coupled Plasmas for Advanced Dry Etching Processes

  Invited

  Nov. 3, 2014, 8:15 AM – Nov. 3, 2014, 9:00 AM

  Authors

  • Waheb Bishara Samer Banna

    • Applied Materials Inc.

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• The Electrical Asymmetry Effect in capacitive RF plasmas: Past, Present, and Future

  Invited

  Nov. 3, 2014, 9:00 AM – Nov. 3, 2014, 9:45 AM

  Authors

  • J. Schulze, A. Derzsi, I. Korolov, S. Brandt, Z. Donko

    • West Virginia University ; Hungarian Academy of Sciences

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• Break

  COFFEE_KLATCH

  Nov. 3, 2014, 9:45 AM – Nov. 3, 2014, 10:15 AM

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• Control of Ion Energy Distributions Through the Phase Difference Between Multiple Frequencies in Capacitively

  Invited

  Nov. 3, 2014, 10:15 AM – Nov. 3, 2014, 11:00 AM

  Authors

  • Yiting Zhang Mark J. Kushner

    • University of Michigan

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• EEDf, IEDf and some of the physics of the Non-ambipolar Electron Plasma (NEP)

  Invited

  Nov. 3, 2014, 11:00 AM – Nov. 3, 2014, 11:45 AM

  Authors

  • Lee Chen Zhiying Chen

    • Tokyo Electron America, Inc.

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• Lunch

  COFFEE_KLATCH

  Nov. 3, 2014, 11:45 AM – Nov. 3, 2014, 1:00 PM

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• Centralized and Coherent Feedforward Impedance Tuning Control and Feedback Power Regulation for the Enhancement of RF Plasma Processing Systems

  Invited

  Nov. 3, 2014, 1:00 PM – Nov. 3, 2014, 1:45 PM

  Authors

  • David Coumou

    • ENI Products, MKS Instruments, Inc

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• Inductively Coupled Plasma Sources for Dry Etching and Annealing Processes

  Invited

  Nov. 3, 2014, 1:45 PM – Nov. 3, 2014, 2:30 PM

  Authors

  • Tomohiro Okumura

    • Panasonic

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• Panel Discussion

  Invited

  Nov. 3, 2014, 2:30 PM – Nov. 3, 2014, 3:00 PM

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