Plasma Etching II
FOCUS · SR2 ·
Presentations
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Physics and chemistry of complex oxide etching and redeposition control
COFFEE_KLATCH · Invited
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Authors
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Jo\"elle Margot
- Physics department, Universit\'e de Montr\'eal
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A complete simulation of InP etching by Cl2/N2/Ar plasma mixture
ORAL
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Authors
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Romain Chanson
- Institut des Materiaux (IMN) - University of Nantes
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Ahmed Rhallabi
- Institut des Materiaux (IMN) - University of Nantes
- Institut des Materiaux Jean Rouxel - University of Nantes
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Marie Claude Fernandez
- Institut des Materiaux (IMN) - University of Nantes
- Institut des Materiaux Jean Rouxel - University of Nantes
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Christophe Cardinaud
- Institut des Materiaux (IMN) - University of Nantes
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Plasma induced UV/VUV damage during Si and GaN device fabrication
COFFEE_KLATCH · Invited
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Authors
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Tetsuya Tatsumi
- Sony Corporation
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Role of Photons, Ion Implantation and Mixing in Sub-threshold Selective Etching of Si
ORAL
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Authors
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Juline Shoeb
- Lam Research Corporation, Fremont, CA
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Saravanapriyan Sriraman
- Lam Research Corporation, Fremont, CA
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Tom Kamp
- Lam Research Corporation, Fremont, CA
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Alex Paterson
- Lam Research Corporation, Fremont, CA
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Plasma damage and restoration of a spin-on organic ultra low-k material (k=2.3)
ORAL
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Authors
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Mikolaj Lukaszewicz
- Wroclaw University
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Jean-Francois de Marneffe
- Imec v.z.w.
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Christopher J. Wilson
- Imec v.z.w.
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Liping Zhang
- Imec v.z.w.
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Christopher J. Wilson
- Imec v.z.w.
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Patrick Verdonck
- Imec v.z.w.
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Mikhail Baklanov
- Imec v.z.w.
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Controlling Ion and UV/VUV Photon Fluxes in Pulsed Low Pressure Plasmas for Materials Processing
ORAL
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Authors
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Peng Tian
- University of Michigan
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Mark J. Kushner
- University of Michigan
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