Plasma Etching I
FOCUS · BT1 ·
Presentations
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Synchronized pulsed plasmas: potential process improvements for patterning technologies
COFFEE_KLATCH · Invited
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Authors
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Olivier Joubert
- Laboratoire des Technologies de la Micro\'electronique, CNRS
- CNRS
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Synchronous Plasma Pulsing for Etch Applications
ORAL
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Authors
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M. Haass
- CNRS-LTM
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M. Darnon
- CNRS-LTM
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E. Pargon
- CNRS-LTM
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S. Banna
- Applied Materials
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O. Joubert
- CNRS-LTM
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The Etch Step in MEMS Deep Silicon Etch
ORAL
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Authors
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Iqbal Saraf
- UT Dallas
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Matthew Goeckner
- UT Dallas
- UTD
- University of Texas at Dallas
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Lawrence Overzet
- UT Dallas
- UTD
- University of Texas at Dallas
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Dual-RF-Mode Inductively Coupled Plasma (ICP) Source for Advanced Dry Etching Processes
ORAL
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Authors
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Samer Banna
- Applied Materials Inc.
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Ankur Agarwal
- Applied Materials Inc.
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Valentin Todorow
- Applied Materials Inc.
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Shahid Rauf
- Applied Materials
- Applied Materials Inc.
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Ken Collins
- Applied Materials
- Applied Materials Inc.
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Analysis of gallium nitride (GaN) surface interacted with chlorine etching plasma beams
ORAL
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Authors
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Shang Chen
- Nagoya University
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Ryosuke Kometani
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Kenji Ishikawa
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Hiroki Kondo
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Keigo Takeda
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Hiroki Kano
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Yutaka Tokuda
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Makoto Sekine
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Masaru Hori
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Deep Gallium Nitride Etching
ORAL
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Authors
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Julien Ladroue
- GREMI - STMicroelectronics
- GREMI
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Mohamed Boufnichel
- STMicroelectronics
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Thomas Tillocher
- GREMI
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Philippe Lefaucheux
- GREMI
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Pierre Ranson
- GREMI
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R\'emi Dussart
- Universite d'Orleans
- GREMI
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Anisotropic Cl$_{2}$-based ICP etching of III-Vs with the addition of Si-containing gases
ORAL
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Authors
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L. Gatilova
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S. Bouchoule
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G. Patriarche
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S. Guilet
- CNRS-LPN
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