Materials Processing in Low Pressure Plasmas I: Etching, deposition, new materials
FOCUS · DT1 ·
Presentations
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A new generation of cryogenic processes for silicon deep etching
COFFEE_KLATCH · Invited
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Authors
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Remi Dussart
- U d'Orleans
- GREMI - University of Orleans
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Student Excellence Award Finalist: Modeling of Deep Reactive Ion Etching of Si under plasma molding in 2f-CCP in SF$_6$/O$_2$
ORAL
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Authors
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Fukutaro Hamaoka
- Keio University
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Takashi Yagisawa
- Keio University
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Toshiaki Makabe
- Keio University
- Keio Univ.
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Student Excellence Award Finalist: Neutral production in SF$_6$/SiCl$_4$ inductively coupled plasmas
ORAL
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Authors
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C. Duluard
- GREMI, Orleans
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R. Dussart
- GREMI - Universite d'Orleans
- GREMI, Orleans
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L.E. Pichon
- GREMI, Orleans
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E.H. Oubensaid
- GREMI, Orleans
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P. Lefaucheux
- U d'Orleans
- GREMI, Orleans
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P. Ranson
- U d'Orleans
- GREMI, Orleans
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M. Puech
- Alcatel Micro Machining Systems
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Atomic-scale model analysis of the feature profile evolution during Si etching in chlorine- and bromine-containing plasmas
ORAL
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Authors
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Shoki Irie
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Yugo Osano
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Masahito Mori
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Koji Eriguchi
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Kouichi Ono
- Kyoto University
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Effect of VUV Radiation on Fluorination of Polypropylene in Low Pressure Plasmas
ORAL
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Authors
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Yang Yang
- Iowa State University
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Mark Strobel
- 3M, Inc.
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Seth Kirk
- 3M, Inc.
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Mark J. Kushner
- Iowa State University
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Effect of gas mixture ratio on atomic oxygen density in an inductively coupled plasma in O$_{2}$/Ar mixture
ORAL
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Authors
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Toshikazu Sato
- Keio Univ.
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Toshiaki Makabe
- Keio University
- Keio Univ.
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Student Excellence Award Finalist: Ion Flux and Energy Measurement at a Pulsed Biased Electrode in a C$_{2}$H$_{2}$:Argon Inductively Coupled Plasma During DLC Growth.
ORAL
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Authors
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A. Baby
- Nanotechnology and Integrated BioEngineering Centre, University of Ulster
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C.M.O. Mahony
- University of Ulster
- Nanotechnology and Integrated BioEngineering Centre, University of Ulster
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P.D. Maguire
- Nanotechnology and Integrated BioEngineering Centre, University of Ulster
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