Compact, On-chip, Integrated three dimensional Lattice

POSTER

Abstract

We present the design of a compact atom chip system that provides a three dimensional optical lattice combined with thru-chip imaging. Optical beams are launched from fibers mounted directly to the exterior of a high resolution (0.4NA) imaging objective. Miniature polarizers, wave plates, and mirrors located on the exterior of the objective control the polarization state and alignment of the lattice, while on-chip optics are used to provide retro-reflection. Three mutually orthogonal lattice beams traverse from the ambient side of the chip through a central window of a silicon and glass substrate, intersecting 300 microns below the vacuum side chip surface. The combined atom chip and optical system fills a volume of less than 36 cm$^{3}$. Atoms may be cooled using standard techniques [1], and directly loaded into the optical lattice. This system is designed with the intention of reducing vibrational noise, providing high resolution in-lattice imaging, combining electric and magnetic fields to generate arbitrary potentials, and performing high repetition rate experiments. \\[4pt] [1] Farkas, Daniel M. et al. Appl. Phys. Lett, 96, 093102 (2010).

*This work was supported by NASA Jet Propulsion Laboratory, and the National Science Foundation Graduate Research Fellowship.

Authors

  • Phoebe M. Tengdin

    • Department of Electrical, Energy, and Computer Engineering, University of Colorado, Boulder, and JILA
  • Evan A. Salim

    • ColdQuanta Inc.
    • Coldquanta, Inc.
  • Dana Z. Anderson

    • JILA, NIST, and Deptartment of Physics, University of Colorado at Boulder
    • Department of Physics and JILA, University of Colorado at Boulder
    • Department of Physics, University of Colorado, Boulder, JILA and NIST
    • Department of Physics and JILA, University of Colorado, and NIST