Multilayer Interconnects for Microfabricated Surface Electrode Ion Traps

POSTER

Abstract

Microfabricated surface electrode traps for ions are a promising technology for building scalable trapping geometries for quantum information processing. We have expanded upon our single layer gold-on-fused-silica surface electrode trap [1] to include a second patterned conducting layer under the trapping electrodes and have demonstrated the fabrication of this architecture using standard microfabrication techniques. The multilayer approach allows for a significant increase in multi-zone trapping complexity and permits improved trapping structures that are otherwise unattainable in single layer designs without vertical interconnects through the wafer. Using improved calculational methods [2], we are in the process of optimizing the planar designs to create modular elements that can be joined into larger multi-zone trapping structures. Work supported by DTO and NIST. 1. S. Seidelin \textit{et al.}, Phys. Rev. Lett. \textbf{96}, 253003 (2006). Also, see the abstract by S. Seidelin. 2. See the abstract by J. H. Wesenberg.

Authors

  • Jason Amini

    • NIST
  • Signe Seidelin

    • NIST
  • Janus Wesenberg

    • NIST
  • Joe Britton

    • NIST
  • Brad Blakestad

    • NIST
  • Kenton Brown

    • NIST
  • Ryan Epstein

    • NIST
  • Jonathan Home

    • NIST
  • John Jost

    • NIST
  • Chris Langer

    • NIST
  • Dietrich Leibfried

    • NIST
  • Roee Ozeri

    • NIST
  • David Wineland

    • NIST